FE Modeling of Stress Distribution in MAO Coating on TC4 Substrate under Thermal Shock Cyclic Loading

2014 ◽  
Vol 941-944 ◽  
pp. 1629-1632 ◽  
Author(s):  
Ye Sheng Zhong ◽  
Li Ping Shi ◽  
Ming Wei Li ◽  
Jia Yu ◽  
Jian Han Liang ◽  
...  
Keyword(s):  
Shear Stress ◽  
Thermal Stress ◽  
Stress Distribution ◽  
Adhesive Strength ◽  
Thermal Cycle ◽  
Radial Stress ◽  
Numerical Study ◽  
Element Analysis ◽  
Solid Element ◽  
Cycle Loading

A numerical study using finite element analysis (FEA) was performed to investigate the thermal, shear and radial stresses developed in MAO coating on substrate of TC4 under thermal cycle loading. The four-node quadrilateral thermal solid element PLANE55 and four-node quadrilateral structural solid element PLANE42 with axisymmetric option was used to model the temperature distribution and thermal stress field of the MAO coating on TC4 substrates. The thermal stress, radial stress and shear stress along the thickness in film/substrate system are analyzed systematically under different thermal cycle loading. It is found that the thermal stress of MAO coating exhibits a linear relationship with thickness of substrate, but it exhibit a parabolic relationship with the thickness of the coating. The radial stress and shear stress distribution of the coating–substrate combination are also calculated. It is observed that high tensile shear stress of MAO coating on TC4 substrate reduces its adhesive strength but high-compressive shear stress improves its adhesive strength.

Preparation and Characterization Composite Ceramic Coating Doped with ZrO2 Particles on TC4 by MAO

2014 ◽  
Vol 941-944 ◽  
pp. 1593-1596 ◽  
Author(s):  
Ye Sheng Zhong ◽  
Li Ping Shi ◽  
Ming Wei Li ◽  
Jia Yu ◽  
Jian Han Liang ◽  
...  
Keyword(s):  
Shear Stress ◽  
Thermal Stress ◽  
Adhesive Strength ◽  
Thermal Cycle ◽  
Radial Stress ◽  
Numerical Study ◽  
Composite Ceramic ◽  
Element Analysis ◽  
Solid Element ◽  
Cycle Loading

A numerical study using finite element analysis (FEA) was performed to investigate the thermal, shear and radial stresses developed in MAO coating on substrate of TC4 under thermal cycle loading. The four-node quadrilateral thermal solid element PLANE55 and four-node quadrilateral structural solid element PLANE42 with axisymmetric option was used to model the temperature distribution and thermal stress field of the MAO coating on TC4 substrates. The thermal stress, radial stress and shear stress along the thickness in film/substrate system are analyzed systematically under different thermal cycle loading. It is found that the thermal stress of MAO coating exhibits a linear relationship with thickness of substrate, but it exhibit a parabolic relationship with the thickness of the coating. The radial stress and shear stress distribution of the coating–substrate combination are also calculated. It is observed that high tensile shear stress of MAO coating on TC4 substrate reduces its adhesive strength but high-compressive shear stress improves its adhesive strength.

Finite Element Analysis of Thermal Stress Distribution in Planar SOFC

2019 ◽  
Vol 7 (1) ◽  
pp. 1977-1986 ◽  
Author(s):  
Chih-Kuang Lin ◽  
Tsung-Ting Chen ◽  
An-Shin Chen ◽  
Yau-Pin Chyou ◽  
Lieh-Kwang Chiang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Stress ◽  
Stress Distribution ◽  
Element Analysis ◽  
Thermal Stress Distribution

Numerical Study of the Shear Stress Distribution in an I-Beam in the Load Application Zone

2019 ◽  
Vol 974 ◽  
pp. 659-664 ◽  
Author(s):  
Sergey Saiyan ◽  
Alexander Paushkin
Keyword(s):  
Shear Stress ◽  
Stress Distribution ◽  
Software Package ◽  
Numerical Study ◽  
Shear Stress Distribution ◽  
Load Application ◽  
Tangential Stresses

A study on the Saint-Venant principle implementation for a rigidly clamped I-beam loaded with various loads at the free end was carried out. When using the software package LIRA SAPR, the tangential stresses perturbations zones are determined in order to compare their distribution with the materials resistance solution.

Shear Stress Discontinuities in Adhesive Joints

2015 ◽  
Vol 1088 ◽  
pp. 758-762
Author(s):  
Xiao Cong He
Keyword(s):  
Shear Stress ◽  
Stress Concentration ◽  
Stress Distribution ◽  
Three Dimensional ◽  
Adhesive Layer ◽  
Adhesive Joints ◽  
Shear Stress Distribution ◽  
Element Analysis ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element

This paper deals with the stress discontinuities in shear stress distribution of adhesive joints. The three-dimensional finite element analysis (FEA) software was used to model the joints and predict the shear stress distribution along the whole beam. The FEA results indicated that there are stress discontinuities existing in the shear stress distribution within adhesive layer and adherends at the lower interface and the upper interface of the boded section. The numerical values of the shear stress concentration at key locations of the joints and the stress concentration ratio are discussed.

Failure Analysis on the Fracture Shaft of a Centrifugal Pump Used for Diesel Engine Cooling System

2021 ◽  
Vol 892 ◽  
pp. 107-114
Author(s):  
Wathan Saiful ◽  
Husaini ◽  
Ali Nurdin
Keyword(s):  
Shear Stress ◽  
Stress Intensity ◽  
Cooling System ◽  
Numerical Study ◽  
Shaft Fracture ◽  
Initial Crack ◽  
Centrifugal Pumps ◽  
Element Analysis ◽  
Engine Cooling ◽  
Torsional Loads

Shaft failures often occur, even in the shafts of centrifugal pumps. This study aims to determine the cause of shaft fracture through experimental and numerical study. The fracture surface was observed using Scanning Electron Microscopy (SEM) to identify the initial crack. The chemical composition test results show that the material used was in accordance with the AISI 420 standard, which is necessary to make Finite Element Analysis (FEA) modelling. Shear stress, strain and stress intensity factors were analysed around the fillet using FEA. The results show that the value of maximum stress intensity factor, KI, occurs in the multilevel shaft fillets that experienced initial cracks due to torsional loads. The shear stress value, obtained from the FEA, was higher than the shear stress value of the material. The KI value, also derived from the FEA, was higher than the KICvalue of the material.

Finite Element Analysis of Thermal Stress in Multi-Arc Ion Plated ZrTiN Hard Coatings

2010 ◽  
Vol 139-141 ◽  
pp. 369-373 ◽  
Author(s):  
Pei Yan ◽  
Jian Xin Deng ◽  
Hai Bing Cui ◽  
Xing Ai ◽  
Jun Zhao
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Shear Stress ◽  
Thermal Stress ◽  
Coating Thickness ◽  
Deposition Temperature ◽  
Thermal Stresses ◽  
Hard Coatings ◽  
Element Analysis ◽  
Stress Components

The thermal stresses generated in ZrTiN coating deposited on HSS and tungsten carbide substrates are investigated by finite element analysis and calculated by mathematics model. FEM analysis provides detailed information about all stress components. The influence of deposition temperature, substrate materials, coating thickness and interlayers on the generation is analyzed. The thermal stress of coatings has a linear relationship with deposition temperature, and an inverse relationship with the coating thickness. The results of simulated thermal stress are in accordance with the analytical method. The highest shear stress found at the interface between the coating and substrate indicates that the interface is the critical location which is learned from the failure point of view. Results also show that the insertion of TiZr interlayer between the coating and substrate can reduce the stress components especially the shear stress. The interlayer thickness has a great effect on stress reduction.

Numerical Study of Cruciform Specimens for Biaxial Tensile Tests

2016 ◽  
Author(s):  
Luis F. Puente Medellín ◽  
Antonio Balvantin ◽  
J. A. Diosdado-De la Peña
Keyword(s):  
Shear Stress ◽  
Stress Distribution ◽  
Normal Stress ◽  
Sheet Metal ◽  
Numerical Study ◽  
Tensile Tests ◽  
Thickness Reduction ◽  
Shear Stresses ◽  
Normal Stress Distribution ◽  
Biaxial Tensile

This paper presents a numerical study of different geometries of cruciform specimens for biaxial tensile tests. The aim of these specimens is to be used on fixtures for biaxial tests mounted in universal testing machines. For the study, a model of isotropic material for steel sheet metal specimens was considered. Thus, only the mechanical properties of the sheet metal in the rolling direction were considered in the simulations. In this numerical analysis, the normal stress distribution and the consequent shear stress were studied. Additionally, the effect of the inclusion of multiple slots as well as a thickness reduction on the normal and shear stresses were assessed. Hence, a specimen in which a uniform normal stress distribution with zero shear stress, is necessary. The results of the analysis show that a specimen with features, multiple slots and a thickness reduction in the central area, provides a better performance in the simulations than dismissing any of these characteristics. Finally, a specimen model suitable for the mentioned test is proposed according to the obtained numerical results and the feasibility of manufacture of the experimental sample-test.

Thermal Stress and Failure Location Analysis for Through Silicon via in 3D Integration

2015 ◽  
Vol 32 (1) ◽  
pp. 47-53 ◽  
Author(s):  
H.-Y. Tsai ◽  
C.-W. Kuo
Keyword(s):  
Thermal Expansion ◽  
Thermal Stress ◽  
High Temperature ◽  
Stress Distribution ◽  
Surface Area ◽  
Dielectric Material ◽  
Three Dimensional ◽  
3D Integration ◽  
Element Analysis ◽  
Through Silicon Via

AbstractThrough silicon via (TSV) is the critical structure for three dimensional (3D) integration, which provides vertical interconnection between stacking dies. In TSV structure, large coefficient differences of thermal expansion exist between silicon substrate, dielectric material, and filled metal. Due to the large thermal mismatch, the high thermal stress occurring at the interface of different materials would result in delamination. Therefore, thermal-mechanical reliability is a key issue for 3D integration. In this study, we investigated the thermal-mechanical stress distribution of TSV under the condition of the accelerated thermal cycling loading by finite element analysis based on a 3D model of TSV structure. Due to the thermal expansion, that the TSV structure squeezed the surface area between TSVs at a high temperature resulted in compressive stresses at the surface area between TSVs. Therefore, a proper distance between the stress-sensitive device and the TSV should be kept. The stress analysis shows that the maximum thermal stress occurs in the outside region of TSV interface and in the annular region of TSV at a high temperature and at a low temperature, respectively. This study helps to obtain a clear thermal stress distribution of TSV and possible failure regions can be determined.

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