scholarly journals Evaluating the Effect of Embedment Depth on Collapse Failure Analysis of Strip Foundation

2021 ◽  
Vol 9 (5A) ◽  
pp. 1-9
Author(s):  
M. M. Nujid ◽  
J. Idrus ◽  
N. F. Bawadi ◽  
A. A. Firoozi
Keyword(s):  
Failure Analysis ◽  
Embedment Depth ◽  
Strip Foundation ◽  
Collapse Failure

On collapse failure analysis of subsea corroded sandwich pipelines under external pressure

2016 ◽  
Author(s):  
Xiao-li Shen ◽  
Sun-ting Yan ◽  
Fei Wang ◽  
Ming Zhang ◽  
Hao Ye ◽  
...  
Keyword(s):  
Failure Analysis ◽  
External Pressure ◽  
Collapse Failure

Failure Analysis of Strip Foundation on Layered Soil Under Static Loading

2021 ◽  
pp. 339-350
Author(s):  
Masyitah Md Nujid ◽  
Fatimah Abdul Rahman ◽  
Ng Kok Shien ◽  
Noorsuhada Md Nor ◽  
Juraidah Ahmad ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Static Loading ◽  
Layered Soil ◽  
Strip Foundation

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

Using the scanning electron microscope for failure analysis of high density magnetic media

1987 ◽  
Vol 45 ◽  
pp. 392-393
Author(s):  
Evelyn R. Ackerman ◽  
Gary D. Burnett
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Failure Analysis ◽  
High Density ◽  
Magnetic Media ◽  
Specific Data ◽  
Retrieval Systems ◽  
Operating Environments ◽  
The Media ◽  
Scanning Electron

Advancements in state of the art high density Head/Disk retrieval systems has increased the demand for sophisticated failure analysis methods. From 1968 to 1974 the emphasis was on the number of tracks per inch. (TPI) ranging from 100 to 400 as summarized in Table 1. This emphasis shifted with the increase in densities to include the number of bits per inch (BPI). A bit is formed by magnetizing the Fe203 particles of the media in one direction and allowing magnetic heads to recognize specific data patterns. From 1977 to 1986 the tracks per inch increased from 470 to 1400 corresponding to an increase from 6300 to 10,800 bits per inch respectively. Due to the reduction in the bit and track sizes, build and operating environments of systems have become critical factors in media reliability.Using the Ferrofluid pattern developing technique, the scanning electron microscope can be a valuable diagnostic tool in the examination of failure sites on disks.

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