Single-Mode Vertical Integration of Active Devices within Passive Waveguides of InP-Based Planar WDM Components

Author(s):  
Valery I. Tolstikhin
2019 ◽  
Vol 12 (5) ◽  
pp. 367-371
Author(s):  
Yibang Wang ◽  
Xingchang Fu ◽  
Aihua Wu ◽  
Chen Liu ◽  
Peng Luan ◽  
...  

AbstractWe present details of on-wafer-level 16-term error model calibration kits used for the characterization of W-band circuits based on a grounded coplanar waveguide (GCPW). These circuits were fabricated on a thin gallium arsenide (GaAs) substrate, and via holes, were utilized to ensure single mode propagation (i.e., eliminating the parallel-plate mode or surface mode). To ensure the accuracy of the definition for the calibration kits, multi-line thru-reflect-line (MTRL) assistant standards were also fabricated on the same wafer and measured. The same wafer also contained passive and active devices, which were measured subject to both 16-term and conventional line-reflect-reflect-match calibrations. Measurement results show that 16-term calibration kits are capable of determining the cross-talk more accurately. Other typical calibration techniques were also implemented using the standards on the GCPW calibration kits, and were compared with the MTRL calibration using a passive device under test. This revealed that the proposed GCPW GaAs calibration substrate could be a feasible alternative to conventional CPW impedance standard substrates, for on-wafer measurements at W-band and above.


Photonics ◽  
2021 ◽  
Vol 8 (11) ◽  
pp. 492
Author(s):  
Amlan kusum Mukherjee ◽  
Mingjun Xiang ◽  
Sascha Preu

Present-day photonic terahertz (100 GHz–10 THz) systems offer dynamic ranges beyond 100 dB and frequency coverage beyond 4 THz. They yet predominantly employ free-space Terahertz propagation, lacking integration depth and miniaturisation capabilities without sacrificing their extreme frequency coverage. In this work, we present a high resistivity silicon-on-insulator-based multimodal waveguide topology including active components (e.g., THz receivers) as well as passive components (couplers/splitters, bends, resonators) investigated over a frequency range of 0.5–1.6 THz. The waveguides have a single mode bandwidth between 0.5–0.75 THz; however, above 1 THz, these waveguides can be operated in the overmoded regime offering lower loss than commonly implemented hollow metal waveguides, operated in the fundamental mode. Supported by quartz and polyethylene substrates, the platform for Terahertz photonic integrated circuits (Tera-PICs) is mechanically stable and easily integrable. Additionally, we demonstrate several key components for Tera-PICs: low loss bends with radii ∼2 mm, a Vivaldi antenna-based efficient near-field coupling to active devices, a 3-dB splitter and a filter based on a whispering gallery mode resonator.


2018 ◽  
Vol 81 (3) ◽  
pp. 30501
Author(s):  
Saikat Majumder ◽  
Rajib Chakraborty

A waveguide based structure on silicon on insulator platform is proposed for vertical integration in photonic integrated circuits. The structure consists of two multimode interference couplers connected by a single mode (SM) section which can act as a bridge over any other underlying device. Two more SM sections acts as input and output of the first and second multimode couplers respectively. Potential application of this structure is in multilayered photonic links. It is shown that the efficiency of the structure can be improved by making some design modifications. The entire simulation is done using effective-index based matrix method. The feature size chosen are comparable to waveguides fabricated previously so as to fabricate the proposed structure easily.


1992 ◽  
Vol 139 (5) ◽  
pp. 353 ◽  
Author(s):  
J. Pelayo ◽  
J. Paniello ◽  
N. Gisin ◽  
J.W. Burgmeijer ◽  
M. Blondel ◽  
...  

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