Some Practical Aspects of FT-IR/PBDS. Part II: Sample Handling Procedures

1987 ◽  
Vol 41 (2) ◽  
pp. 280-287 ◽  
Author(s):  
M. J. D. Low ◽  
C. Morterra

FT-IR photothermal beam deflection spectroscopy (PBDS) is truly nondestructive in that none of the sample preparation methods needed for the IR examination of solids are mandated. Such nondestructive examination is, however, inefficient—in that long scanning times are frequently needed—and is not really required with many samples. If it is permissible to subject the sample to a simple hand grinding, efficiency can be greatly improved. Sample preparation and handling are discussed, and the peculiarities of certain samples are described. Particular emphasis is placed on the necessity of proper sample handling for surface studies, data of the vacuum pyrolysis of polyvinyledene being used as example.

2010 ◽  
Vol 24 (5) ◽  
pp. 511-516 ◽  
Author(s):  
Shan-Yang Lin ◽  
Chih-Cheng Lin ◽  
Ting-Huei Lee

Salmon calcitonin (sCT) was selected as a model protein drug for investigating its structural similarity in the solid state by four sample preparation methods, such as tape, smeared, CaF2and film methods. The conformational changes of sCT in the solid state were estimated by using a second-derivative Fourier transform infrared (FT-IR) microspectroscopy. The tape method was acted as a standard reference.The value of correlation coefficient (r) for smeared method was higher than that of other method, indicating that a novel technique by smearing sCT powder on the surface of KBr pellet was the best optimal sample preparation method.


Planta Medica ◽  
2016 ◽  
Vol 82 (05) ◽  
Author(s):  
M Wilcox ◽  
M Jacyno ◽  
J Marcu ◽  
J Neal-Kababick

Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.


2021 ◽  
Vol 20 ◽  
pp. 100079
Author(s):  
Maxwell C. McCabe ◽  
Lauren R. Schmitt ◽  
Ryan C. Hill ◽  
Monika Dzieciatkowska ◽  
Mark Maslanka ◽  
...  

2011 ◽  
Vol 26 (9) ◽  
pp. 1849 ◽  
Author(s):  
J. S. F. Pereira ◽  
C. L. Knorr ◽  
L. S. F. Pereira ◽  
D. P. Moraes ◽  
J. N. G. Paniz ◽  
...  

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