scholarly journals Surface Analysis Society of Japan for Reliability Improvement and Standardization

2020 ◽  
Vol 27 (1) ◽  
pp. 1-1
Author(s):  
Hisao Makino
2012 ◽  
Vol 11 (1) ◽  
pp. 7-19 ◽  
Author(s):  
Silke Astrid Eisenbeiß ◽  
Steffen R. Giessner

The present paper gives a review of empirical research on ethical leadership and shows that still little is known known about the contextual antecedents of ethical leadership. To address this important issue, a conceptual framework is developed that analyzes the embeddedness of organizational ethical leadership. This framework identifies manifest and latent contextual factors on three different levels of analysis – society, industry, and organization – which can affect the development and maintenance of ethical leadership. In particular, propositions are offered about how (1) societal characteristics, notably the implementation and the spirit of human rights in a society and societal cultural values of responsibility, justice, humanity, and transparency; (2) industry characteristics such as environmental complexity, the content of the organizational mandate, and the interests of stakeholder networks; and (3) intra-organizational characteristics, including the organizational ethical infrastructure and the ethical leadership behavior of a leader’s peer group, influence the development and maintenance of ethical leadership in organizations. This list of factors is not exhaustive, but illustrates how the three levels may impact ethical leadership. Implications for managerial practice and future research are discussed.


2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  

Author(s):  
Masahito Katto ◽  
Atushi Yokotani ◽  
Masanori Kaku ◽  
Shoichi Kubodera ◽  
Nobuyoshi Miyabayashi ◽  
...  

2018 ◽  
Vol 8 (2) ◽  
pp. 250-258
Author(s):  
B. N. Lakshminarayana ◽  
T. N. Mahadeva Prasad ◽  
N. R. Sreenatha ◽  
D. P. Ganesha ◽  
B. K. Manuprasad ◽  
...  

Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


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