scholarly journals Surface Analysis Society of Japan for Reliability Improvement and Standardization

2020 ◽  
Vol 27 (1) ◽  
pp. 1-1
Author(s):  
Hisao Makino
Keyword(s):  
Surface Analysis ◽  
Reliability Improvement ◽  
Analysis Society

scholarly journals Results of Questionnaire Survey on Depth Profiling Performed in Surface Analysis Society of Japan

2016 ◽  
Vol 23 (2) ◽  
pp. 98-110
Author(s):  
T. Nagatomi ◽  
K. Takahashi ◽  
H. Yoshikawa
Keyword(s):  
Surface Analysis ◽  
Questionnaire Survey ◽  
Depth Profiling ◽  
Analysis Society

The Emergence and Maintenance of Ethical Leadership in Organizations

2012 ◽  
Vol 11 (1) ◽  
pp. 7-19 ◽  
Author(s):  
Silke Astrid Eisenbeiß ◽  
Steffen R. Giessner
Keyword(s):  
Cultural Values ◽  
Ethical Leadership ◽  
Leadership Behavior ◽  
Peer Group ◽  
Organizational Characteristics ◽  
Future Research ◽  
Environmental Complexity ◽  
Group Influence ◽  
Analysis Society ◽  
Different Levels

The present paper gives a review of empirical research on ethical leadership and shows that still little is known known about the contextual antecedents of ethical leadership. To address this important issue, a conceptual framework is developed that analyzes the embeddedness of organizational ethical leadership. This framework identifies manifest and latent contextual factors on three different levels of analysis – society, industry, and organization – which can affect the development and maintenance of ethical leadership. In particular, propositions are offered about how (1) societal characteristics, notably the implementation and the spirit of human rights in a society and societal cultural values of responsibility, justice, humanity, and transparency; (2) industry characteristics such as environmental complexity, the content of the organizational mandate, and the interests of stakeholder networks; and (3) intra-organizational characteristics, including the organizational ethical infrastructure and the ethical leadership behavior of a leader’s peer group, influence the development and maintenance of ethical leadership in organizations. This list of factors is not exhaustive, but illustrates how the three levels may impact ethical leadership. Implications for managerial practice and future research are discussed.

Reliability Improvement of Ground Fault Protection System Using an S-Type Horn Attachment Gap in AC Feeding System

2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  
Keyword(s):  
Protection System ◽  
Feeding System ◽  
Reliability Improvement ◽  
Ground Fault ◽  
Fault Protection ◽  
Ground Fault Protection

Surface analysis system by VUV photons-stimulated desorption

2010 ◽  
Author(s):  
Masahito Katto ◽  
Atushi Yokotani ◽  
Masanori Kaku ◽  
Shoichi Kubodera ◽  
Nobuyoshi Miyabayashi ◽  
...  
Keyword(s):  
Surface Analysis ◽  
Analysis System

Recent Characterization of Steel by Surface Analysis Methods

1996 ◽  
Vol 82 (7) ◽  
pp. 551-557
Author(s):  
Shigeru SUZUKI
Keyword(s):  
Surface Analysis ◽  
Analysis Methods

Synthesis, Structural, Molecular Docking and Hirshfeld Surface Analysis of (2-((6-chloropyridin-3-yl)methoxy)-5 bromophenyl) (4-chlorophenyl) methanone

2018 ◽  
Vol 8 (2) ◽  
pp. 250-258
Author(s):  
B. N. Lakshminarayana ◽  
T. N. Mahadeva Prasad ◽  
N. R. Sreenatha ◽  
D. P. Ganesha ◽  
B. K. Manuprasad ◽  
...  
Keyword(s):  
Molecular Docking ◽  
Surface Analysis ◽  
Hirshfeld Surface ◽  
Hirshfeld Surface Analysis

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

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