Beneficial effect of Trichopus zeylanicus extract on mercuric chloride-induced hepatotoxicity in rats

A. A. Chugaev (Tr. I Congress of Khir. Levob. Ukraine, 1925), on the basis of clinical observations, considers renal decapsulation quite indicated in those cases of mercuric chloride poisoning, where anuria has developed. Of the 5 such cases observed by the author, in 2 only this operation helped to save patients. At the same time, decapsulation sometimes gives an effect when it is applied unilaterally. In favor of the beneficial effect of this operation with sublimate nephrosis, the results of experimental studies by M.L. Meerson (ibid.) Also speak.

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Microstructures of Ti-1.5 w/o Ni Alloys with Mo and A1 Additions

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100113895 ◽

1975 ◽

Vol 33 ◽

pp. 54-55

Author(s):

Anna C. Fraker

Keyword(s):

Corrosion Resistance ◽

Beneficial Effect ◽

Crevice Corrosion ◽

Local Corrosion ◽

Precipitate Size ◽

Ni Alloys

Small amounts of nickel are added to titanium to improve the crevice corrosion resistance but this results in an alloy which has sheet fabrication difficulties and is subject to the formation of large Ti2Ni precipitates. These large precipitates can serve as local corrosion sites; but in a smaller more widely dispersed form, they can have a beneficial effect on crevice corrosion resistance. The purpose of the present work is to show that the addition of a small amount of Mo to the Ti-1.5Ni alloy reduces the Ti2Ni precipitate size and produces a more elongated grained microstructure. It has recently been reported that small additions of Mo to Ti-0.8 to lw/o Ni alloys produce good crevice corrosion resistance and improved fabrication properties.

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On the role of tin underlays for the prevention of thermal grooving in thin gold films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100145030 ◽

1986 ◽

Vol 44 ◽

pp. 732-733

Author(s):

Jin Young Kim ◽

R. E. Hummel ◽

R. T. DeHoff

Keyword(s):

Thin Film ◽

Free Surface ◽

Grain Boundary ◽

Beneficial Effect ◽

Failure Mechanism ◽

Failure Mechanisms ◽

Distinct Advantage ◽

Gold Films ◽

Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

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