Precision Tool Condition Monitoring for Grinding Wheel in IC Manufacturing of Silicon Wafer
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2018 ◽
Vol 96
(1-4)
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pp. 67-79
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2014 ◽
Vol 37
(2)
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pp. 627-640
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2019 ◽
Vol 106
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pp. 1385-1395
1999 ◽
Vol 8
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pp. 096369359900800
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Vol 46
(2)
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pp. 218-224
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