Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints

1993 ◽  
Vol 21 (5) ◽  
pp. 346
Author(s):  
DR Petersen ◽  
JB Zafran ◽  
BI Sandor
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Thermal Fatigue Life ◽  
Influence Of Substrate

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

scholarly journals Evaluation for Thermal Fatigue Life of Electronic Device Solder Joints utilizing Car

2003 ◽  
Vol 2003.16 (0) ◽  
pp. 699-700
Author(s):  
Qiang YU ◽  
Masaki SHIRATORI ◽  
Hae Ki NAM ◽  
Kazuhiru HIYAKE ◽  
Kazuhiro IGARASHI ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Thermal Fatigue Life
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