Mechanical Design and Development of Agricultural Robot

This paper presents the design and development of a modular littoral autonomous underwater vehicle called “ZYRA” having six degrees of freedom for performing the following tasks underwater: target (sound sources emitting frequencies between 1 Hz and 180 KHz) localization and homing, buoy detection. The development of the AUV has been divided into, namely, five sections: mechanical design and fabrication, embedded and power systems, control and software, image processing, and underwater acoustics. A fully functional AUV has been tested in a self-created arena with different tasks spread out in a shallow water environment. Two different kinds of experimental results have been presented: first the experimental results of the SONAR module and second based on the number of successful outcomes per total number of trials for each task.

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Mechanical Design and Development of a Continuous Rotational Variable Stiffness Actuator

2021 3rd International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA) ◽

10.1109/hora52670.2021.9461398 ◽

2021 ◽

Author(s):

Kevin Castelli ◽

Marco Gavioli ◽

Yevheniy Dmytriyev ◽

Hermes Giberti

Keyword(s):

Mechanical Design ◽

Variable Stiffness ◽

Design And Development ◽

Variable Stiffness Actuator

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Multi-Disciplinary Education for Product Design and Development

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.156-157.681 ◽

2010 ◽

Vol 156-157 ◽

pp. 681-684

Author(s):

Ting Liang Guo ◽

Jun Liu

Keyword(s):

Higher Education ◽

Product Design ◽

Materials Science ◽

Mechanical Design ◽

Design Method ◽

College Education ◽

Interdisciplinary Education ◽

Design And Development ◽

Interdisciplinary Teaching ◽

Education Environment

In this paper, puts forward a kind of design method of multi-disciplinary engineering education for product design and development. In educational globalization era, higher education has paid more and more attention to cultivate innovation type of talents, who should receive interdisciplinary education. Mechanical design is an integrative subject. Every student should have a basic ability to finish a product design or plan. As a good mechanical engineer or product designer, should know different kinds of knowledge such as mechanical, materials science, industrial design, economics and so on. Along with the development of higher education popularization, the universities pay more and more attention to the talent cultivation and fusion. Followed by many scholars at home and abroad for interdisciplinary teaching research, its essence is expounded. But although the concept of education that interdisciplinary described the basic form, but to carry out interdisciplinary education in college education environment is not easy even if everyone knows it is very important. In order to solve this problem, the first thing is to break through the traditional education ideas, the second is to set an interdisciplinary teaching organization, the third one is to build a set effective incentive mechanism. So in the paper, puts forward a design method of multi-subjects amalgamation during the education of product design and development.

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DESIGN AND DEVELOPMENT OF A NOVEL TESTING RIG FOR THE EXAMINATION OF ADDITIVELY MANUFACTURED AUXETIC COMPONENTS

Proceedings of the Design Society ◽

10.1017/pds.2021.95 ◽

2021 ◽

Vol 1 ◽

pp. 953-962

Author(s):

Lewis Urquhart ◽

Craig Fingland ◽

Andrew Wodehouse ◽

Brian Loudon

Keyword(s):

Boundary Condition ◽

Real Time ◽

Mechanical Design ◽

New Method ◽

Assembly Process ◽

Design Features ◽

Design And Development ◽

Control Interface ◽

Advanced Control ◽

Auxetic Structures

AbstractThis paper reports upon the design and development of a novel testing rig for the examination of additively manufactured auxetic componentry. By firstly reviewing the key challenges for practical researchers and exploring the range of approaches used to examine auxetic structures, we subsequently introduce a new testing configuration seeking to enhance the existing methods found within the literature. The developed testing configuration includes a novel mechanical design with a new method for component mounting offering advanced control of the boundary condition and a fully developed control interface which facilitates real-time analytics, a range of data acquisitions and integration with a CAD environment. This paper describes both the development of the mechanical design and the development of the control interface by exploring the key design features and documentation of the manufacturing and assembly process. Finally, we discuss how the presented testing configuration offers a new and flexible way of testing auxetic componentry with additional insights offered for future researchers who wish to recreate or adapt the testing setup for their own examinations of additively manufactured componentry.

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The Design and Development of a 15 kV SiC Half-Bridge Multi-Chip Power Module for Medium Voltage Applications

International Symposium on Microelectronics ◽

10.4071/isom-wp53 ◽

2014 ◽

Vol 2014 (1) ◽

pp. 000751-000756 ◽

Cited By ~ 4

Author(s):

Z. Cole ◽

J. Stabach ◽

G. Falling ◽

P. Killeen ◽

T. McNutt ◽

...

Keyword(s):

Thermal Resistance ◽

High Voltage ◽

Flip Chip ◽

Mechanical Design ◽

Three Dimensional ◽

Power Module ◽

Design And Development ◽

Modeling And Analysis ◽

High Level ◽

Three Dimensional Finite Element

In this work, the packaging design and development of a high voltage (> 15 kV), high current (120 A) silicon carbide (SiC) multi-chip power module (MCPM) will be presented. The module implements a MCPM packaging strategy which itself uses subassemblies to reduce manufacturing costs through reworkability. The use of solderless internal connections aids in reducing cost both by simplifying the assembly process as well as enabling a high level of flexibility in the manufacturing process in order to drive down costs by increasing yield. A wire bondless flip-chip die interconnection scheme has been developed in parallel with a more traditional wire bonded method. Both presented approaches utilize a common set of parts with minimal differences due to the divergent portions of each interconnection scheme. Device neutrality in this design ensures that a variety of die types from any manufacturer may be housed in a number of arrangements depending on the requirements of the end-use application without requiring significant redesign effort for each new application or improvement in device technology. The SiC MCPM is constructed using high temperature capable materials, enabling operation at high junction temperatures. This leads to the ability to design a small, low profile module with low parasitic inductances and a small junction to case thermal resistance. A low module thermal resistance makes it possible to significantly reduce the size and complexity of the cooling systems, ultimately, reducing the size of the system. Thus, this novel high voltage SiC MCPM represents a significant step forward in high voltage switching applications. This paper discusses the overall mechanical design of the SiC high voltage MCPM; the three-dimensional finite-element modeling and analysis of the thermal and electrical characteristics of the high voltage power module are also presented.

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Mechanical Design and Development of a Payload for Structural Health Monitoring Experiments on the International Space Station

Volume 11: Acoustics, Vibration, and Phononics ◽

10.1115/imece2019-12093 ◽

2019 ◽

Author(s):

Douglas MacNinch ◽

Daniel Pacheco ◽

Arjun Tandon ◽

Carl Bancroft ◽

Isaac Flores ◽

...

Keyword(s):

Structural Health Monitoring ◽

International Space Station ◽

Health Monitoring ◽

Mechanical Design ◽

Space Station ◽

Space Environment ◽

Design And Development ◽

Self Assessment ◽

International Space ◽

Future Space

Abstract This contribution reports design and development of a payload for structural health monitoring (SHM) experiments on the International Space Station (ISS). The payload was designed to operate in low earth orbit (LEO) environment and fit specifications of the Materials International Space Station Experiment (MISSE) module. In particular, LEO environmental factors such as a strong vacuum, thermal variations from −18°C to 60°C [1], and background radiation were considered. The payload is a rectangular multi-leveled structure which houses several SHM experiments, active sensors self-assessment, and electronic hardware with data storage and retrieval capabilities. SHM experiments include guided wave propagation in a metallic structure, monitoring of an imitated crack, assessment of a bolted joint, investigation of structural vibration via electromechanical impedance method, and acoustic emission monitoring. In addition, piezoelectric sensor self-assessment is realised using impedance diagnostics. It is anticipated that the payload will operate for one year in LEO and provide insights on the effect of space environment on SHM of future space vehicles during long-duration flights. This contribution focuses on mechanical design of the payload to support SHM experiment. Specific arrangement of payload elements and implementation of boundary conditions for SHM experiments are reported. Theoretical calculations and examples of SHM experimental data obtained in laboratory tests are presented and discussed in light of expected variations due to LEO environment. Measures to protect SHM hardware from harsh space environment are presented. Perspective applications of SHM as an integral component of future space systems are discussed.

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