scholarly journals Analisis Karakteristik Elektrik Bentuk Geometri Jalur PCB Menggunakan Pendekatan Finite Element

2018 ◽  
Vol 10 (1) ◽  
pp. 11-17
Author(s):  
Putut Son Maria ◽  
Elva Susianti
Keyword(s):  
Finite Element ◽  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Scientific Literature ◽  
Circuit Board ◽  
Electrical Characteristics ◽  
The Finite Element Method ◽  
Printed Circuit ◽  
The Right ◽  
Aided Design

Some Electronics Computer Aided Design (ECAD) softwares have provided several track shapes to design a Printed Circuit Board (PCB), such as right angle, rounded and trapezoidal. However, it is quite difficult to find scientific literature that can be used as a guide which explains and compiles directly about each character of the geometry. This study aims to analyze and to observe the electrical characteristics of the geometry shape on the Printed Circuit Board (PCB) path by using the finite element method. Each PCB path shape is modeled according to its geometry and physical properties, then calculated for its electrical quantity and be observed for its performance at given current. Simulation and numerical calculations showed that the shape of trapezoidal and rounded geometry have lower resistance and planar inductance of 6.8% and 7.39% respectively than the right angle shape.

FLEXIBLE PROJECT CUSTOMIZATION IN COMPUTER-AIDED DESIGN SYSTEMS

2021 ◽  
Author(s):  
E. A. Sobolev ◽  
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design System ◽  
Programming Environment ◽  
Printed Circuit ◽  
Computer Aided ◽  
Design Systems ◽  
Aided Design ◽  
New Instruments

The article describes customization methods for printed circuit board projects in computer-aided design system Xpedition Enterprise. Two approaches has been detected, first – setting up project using built-in instruments, second – implementation of a new instruments using integrated programming environment.

scholarly journals MODIFICATION OF TOOL FOR MOVING TRACK SEGMENTS IN DELTA DESIGN CAD

2019 ◽  
pp. 130-133
Author(s):  
A. Yu. Gladkevich
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design System ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Advantages And Disadvantages ◽  
Development Tools ◽  
Aided Design

Describes the process of improving and developing tools in computer‑aided design system Delta Design. Currently, the modern  process of PCB development is quite complex and time‑consuming process. Existing CAD systems make it easier to design a  printed circuit Board model by providing powerful development tools. Along with the increasing complexity of modern printed  circuit boards, the requirements for development tools are also growing, making them constantly improve. Using the example  of  the  Delta  Design  system,  the  process  of  improving  the  tool  for  moving  track  segments  is  described.  The  analysis  of  the  advantages and disadvantages of the existing tool is made, and the decision on the need to develop a new algorithm is justified.  Of the two proposed variants of such an algorithm, the optimal one was chosen in terms of the quality of the result obtained and  the convenience of operation.

Phase Equilibria in Complex Solder Systems

1986 ◽  
Vol 72 ◽  
Author(s):  
M. R. Notis ◽  
S. K. Tarby ◽  
T. Cawley
Keyword(s):  
Phase Equilibria ◽  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Eutectic Temperature ◽  
Ternary Eutectic ◽  
Circuit Board ◽  
Scanning Calorimetry ◽  
Printed Circuit ◽  
Aided Design ◽  
Ternary Eutectic Temperature

AbstractTernary solder alloys have come into wide use in chip bonding, printed circuit board connection, and in ceramic package sealing applications. Little is known concerning phase equilibria in many of these systems. Methods for predicting phase equilibria in the ternary (Pb+Sn)+Ag system using CAD (computer aided design) are described, and a predicted value for the ternary eutectic temperature is compared with values obtained by differential scanning calorimetry (DSC) for this system.

Metal Forming and the Finite-Element Method

1989 ◽  
Author(s):  
Shiro Kobayashi ◽  
Soo-Ik Oh ◽  
Taylan Altan
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Metal Forming ◽  
Computer Aided Design ◽  
The Finite Element Method ◽  
Forming Technology ◽  
Computer Aided ◽  
Deformation Mechanics ◽  
Aided Design ◽  
Element Method

The application of computer-aided design and manufacturing techniques is becoming essential in modern metal-forming technology. Thus process modeling for the determination of deformation mechanics has been a major concern in research . In light of these developments, the finite element method--a technique by which an object is decomposed into pieces and treated as isolated, interacting sections--has steadily assumed increased importance. This volume addresses advances in modern metal-forming technology, computer-aided design and engineering, and the finite element method.

Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test

2009 ◽  
Vol 419-420 ◽  
pp. 37-40
Author(s):  
Shiuh Chuan Her ◽  
Shien Chin Lan ◽  
Chun Yen Liu ◽  
Bo Ren Yao
Keyword(s):  
Finite Element ◽  
Experimental Measurement ◽  
Test Specimen ◽  
Printed Circuit Board ◽  
Drop Impact ◽  
Simulation Technique ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Impact

Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-DYNA is applied to compute the impact acceleration and dynamic strain on the test specimen during the drop impact. The finite element results are compared to the experimental measurement of acceleration with good correlation between simulation and drop testing. With the accurate simulation technique, one is capable of predicting the impact response and characterizing the failure mode prior to real reliability test.

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