Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface
Modification
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ABSTRACTSilicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.
2002 ◽
Vol 199
(1-2)
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pp. 135-145
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2019 ◽
Vol 36
(5)
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pp. 531-538
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2008 ◽
Vol 202
(15)
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pp. 3669-3674
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2009 ◽
Vol 63
(28)
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pp. 2516-2519
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1998 ◽
Vol 15
(7)
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pp. 537-538
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2020 ◽
pp. 096739112092907
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