Low temperature, transient liquid phase sintering of B2O3-SiO2-doped Nd:YAG transparent ceramics

2011 ◽  
Vol 26 (9) ◽  
pp. 1151-1158 ◽  
Author(s):  
Adam J. Stevenson ◽  
Elizabeth R. Kupp ◽  
Gary L. Messing
Keyword(s):  
Liquid Phase ◽  
Low Temperature ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Transparent Ceramics ◽  
Temperature Transient ◽  
Transient Liquid Phase Sintering ◽  
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Abstract

High Temperature Sintered Interconnects Formed by Transient Liquid Phase Sintering

2013 ◽  
Vol 2013 (1) ◽  
pp. 000951-000956 ◽  
Author(s):  
Hannes Greve ◽  
F. Patrick McCluskey
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Low Temperature ◽  
Melting Temperature ◽  
Extreme Temperature ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Temperature Conditions ◽  
Transient Liquid Phase Sintering

Low Temperature Transient Liquid Phase Sintering (LT-TLPS) enables the formation of joints robust to high temperatures at low process temperatures. TLPS systems consist of one or more low temperature constituents (i.e. Sn) and one or more high temperature constituents (i.e. Cu). The sinter joints are formed by intermetallic compound formation between these constituents. In this paper a paste based LT-TLPS approach is demonstrated. The organic binders and fluxes used to mix the pastes prevent the metal particles from oxidation and facilitate a vacuum-free process in air without the need of a reducing atmosphere. Pastes based on the Cu-Sn system have been developed enabling a completely pressure-less process. Furthermore sinter pastes for LT-TLPS at low pressure (<0.5MPa) applied during the initial stage of the sintering process have been developed which form almost void free joints. To assess the strength of the sintered joints a high-temperature shear fixture has been designed. Shear tests have been performed at 25°C, 400°C, and 600°C to characterize the influence of high temperature conditions on the joint performance. The shear strength of the joints formed without pressure has been assessed for different Cu-to-Sn ratios at all temperature levels. It is shown that the maximum application temperature and shear strength depends on the ratio of low melting temperature and high melting temperature constituents. The pastes introduced here can be used to form joints resilient to application temperatures of up to 600°C. They show the potential to form joints for reliable operation under extreme temperature conditions.

Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000355-000363 ◽  
Author(s):  
S. Ali Moeini ◽  
Hannes Greve ◽  
F. Patrick McCluskey
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Melting Temperature ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Melting Temperatures ◽  
Softening Behavior ◽  
Temperature Transient ◽  
Transient Liquid Phase Sintering ◽  
Temperature Shear

Low-temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, we will describe the processing and shear strength, along with the shock fatigue resistance of sintered joints made by this process. Joints made from different ratios of Ni and Cu high melting temperature constituents paired with Sn-based low melting temperature constituents have been evaluated. For the shear studies, the softening behavior of test samples joined by Ni-Sn3.5Ag and (Ni,Cu)-Sn3.5Ag sinter pastes have been assessed using a fixture designed for high temperature shear testing up to 600°C. The reliability of sinter paste joints in drop-shock environments will be discussed. It is shown that joints formed from these sinter pastes possess improved drop-shock reliability compared to Sn3.5Ag solder joints and melting temperatures considerably higher than those of conventional high temperature solders (e.g. Pb5.0Sn2.5Ag).

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