Formation of Foamy Coatings by Laser Ablation of Glass-ceramic Substrates in the Nanosecond Regime Substrate - Temperature and Wavelength Dependence

2011 ◽  
Vol 1365 ◽  
Author(s):  
Daniel Sola ◽  
Andrés Escartín ◽  
Jose I. Peña

ABSTRACTA study of the formation mechanisms of foamy coatings on the surface of glass-ceramic substrates produced by laser ablation is presented. Three laser systems emitting at 1064, 532 and 355 nm with pulse-widths in the nanosecond range were used. In the NIR range the formation of the coating is only possible when the temperature of the surface is higher than 300 ºC. In this case, the generation is related to an increase of the layer in liquid-phase produced in the interaction zone. However, when the sample is machined at 532 or 355 nm, it is not necessary to heat the whole surface to be processed. In this case, the local temperature and the pressure exerted over the interaction zone produce the generation of this coating, obtaining the layer at room temperature. Furthermore, the coating can be produced at higher speeds. In this way, it is possible to reduce the energetic cost improving the efficiency of the process.Morphology, microstructure, composition and thermal properties of the layer are described.

2012 ◽  
Vol 2012 (1) ◽  
pp. 000410-000413
Author(s):  
David J Rasmussen

Microelectronics used in automotive applications have grown considerably in the last few years with more high tech electronics controlling more functions in automobiles. In an effort to have more precise control and to reduce vehicle weight manufacturers are integrating more functions into smaller packages. Many of these packages are embedded in molded plastic. This causes challenges when it comes to wirebonding these devices. They often cannot be heated to traditional Gold Ball Thermosonic wirebonding temperatures of 120 – 150C. However, using a heated capillary to bond the parts which remain at room temperature simplifies the process considerably. Alternatives such as pre-heating the parts in an oven and complex hot gas handler systems are not required. With a resistive wire coil heater surrounding a standard (or long capillary for deep access) sufficient heat can be provided to the wire bond site for a strong and reliable interconnect. The bonding surface can be any material used in gold ball bonding: aluminum bond pads on die, plated contacts, ceramic substrates or plated copper traces on PCBs. This paper will show that this heated tool process has been successfully utilized with 1mil Au wire and many of the standard die and substrate materials with little impact on process parameters.


2020 ◽  
Vol 103 (12) ◽  
pp. 6893-6900
Author(s):  
Russell L. Leonard ◽  
Danielle T. Berkowitz ◽  
Austin Thomas ◽  
Adrian Howansky ◽  
Anthony R. Lubinsky ◽  
...  

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