Ceramic Fiber - Fluoropolymer Composites for Electronic Packaging Materials
ABSTRACTAluminum nitride (AIN), alumina and aramid fibers have been incorporated into epoxy and fluoropolymer matrices. The fluoropolymer composites have dielectric constants less than 3.4 and losses below 0.3%, measured out-of-plane. In-plane and out-of-plane thermal conductivities of the AIN-fluoropolymer composites averaged 5.2 and 1.3 W/mK, respectively, at fiber volume fractions of 0.26 to 0.29. In-plane thermal conductivities of woven fabric composites were accurately predicted by mixing rules; for non-woven and short fiber composites, thermal conductivities were less than predicted. These composites had higher out-of-plane thermal conductivities due to out-of-plane components of the fiber orientations.