Ceramic Fiber - Fluoropolymer Composites for Electronic Packaging Materials
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ABSTRACTAluminum nitride (AIN), alumina and aramid fibers have been incorporated into epoxy and fluoropolymer matrices. The fluoropolymer composites have dielectric constants less than 3.4 and losses below 0.3%, measured out-of-plane. In-plane and out-of-plane thermal conductivities of the AIN-fluoropolymer composites averaged 5.2 and 1.3 W/mK, respectively, at fiber volume fractions of 0.26 to 0.29. In-plane thermal conductivities of woven fabric composites were accurately predicted by mixing rules; for non-woven and short fiber composites, thermal conductivities were less than predicted. These composites had higher out-of-plane thermal conductivities due to out-of-plane components of the fiber orientations.
2003 ◽
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pp. 1808-1813
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2011 ◽
Vol 26
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pp. 384-394
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pp. 2085-2091
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pp. 165-174
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1995 ◽
Vol 55
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pp. 41-48
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1998 ◽
Vol 29
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pp. 315-322
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