Measurement of Low-k Polymerimetal Interfacial Toughness Using 4-point Bending Method

1996 ◽  
Vol 436 ◽  
Author(s):  
Qing Ma ◽  
Chuanbin Pan ◽  
Harry Fujimoto ◽  
Baylor Triplett ◽  
Peter Coon ◽  
...  

AbstractFour-point bending method offers significant advantages over more traditional techniques in measuring adhesion properties of thin polymer films. The former utilizes sandwich structure beams where the polymer film and the interface of interest are placed at the center of two elastic bulks. Such confined geometry closely resembles applications where polymer films are used as dielectric layers in IC interconnect technology. In this work, the bonding between a poly(arylene ether) (PAE) based polymer film and an Al film was studied. Ti layers of several different thickness were used as adhesion promoter. The sandwich samples were made by bonding bulk wafers using an epoxy. Fracture energies were seen to increase with the thickness of the Ti layer. Effects of heat treatment were also studied.

2021 ◽  
Vol 314 ◽  
pp. 277-281
Author(s):  
Yuya Akanishi ◽  
Quoc Toan Le ◽  
Efrain Altamirano Sánchez

Particle removal from BEOL low-k structures is studied using a novel particle removal technique, called Nanolift which removes particles from the substrate by forming a thin polymer film on the surface and removing the polymer film together with the particles. It was confirmed that Nanolift is capable to remove TiFx particles successfully which are generated during the low-k dry etch process for dual damascene structure formation for BEOL interconnect fabrication. Pattern collapse of the fragile low-k structure was confirmed to be prevented by Nanolift in comparison with conventional dual fluid spray cleaning method. FTIR results show that Nanolift leaves no residual polymer remain in low-k films and K-value shift by the Nanolift process was negligible and comparable with the conventional formulated chemistry cleaning process. From these results, Nanolift can be concluded as a suitable cleaning process for advanced BEOL fabrication process.


2000 ◽  
Vol 612 ◽  
Author(s):  
Ting Tsui ◽  
Cindy Goldberg ◽  
Greg Braeckelman ◽  
Stan Filipiak ◽  
Bradley M. Ekstrom ◽  
...  

AbstractOne of the important reliability challenges in integrating copper/Low-K dielectric technology has been adhesion between the Low-K dielectric and barrier metal. This investigation explored the applicability of the four-point bend technique for determining the adhesion strength of a fluorine doped low dielectric constant oxide in contact with tantalum barrier layer. Time of flight secondary ion mass spectroscopy (ToFSIMS) was used for surface chemical analyses of the delaminated surfaces to identify the fractured interface and its chemical compositions. The effect of annealing on mechanical strength was coupled with chemical analysis to discern the adhesion properties. Experimental results suggested that fluorine rich interfacial layer formation was associated with degraded adhesion characteristics between Low-K dielectric and tantalum barrier metal.


2000 ◽  
Vol 10 (PR7) ◽  
pp. Pr7-233-Pr7-237 ◽  
Author(s):  
S. Rivillon ◽  
P. Auroy ◽  
B. Deloche

2021 ◽  
Vol 154 ◽  
pp. 106202
Author(s):  
Polina S. Kazaryan ◽  
Maria A. Agalakova ◽  
Elena P. Kharitonova ◽  
Marat O. Gallyamov ◽  
Mikhail S. Kondratenko

2016 ◽  
Vol 108 (5) ◽  
pp. 051604 ◽  
Author(s):  
Iman Nejati ◽  
Mathias Dietzel ◽  
Steffen Hardt

2020 ◽  
Vol 126 (9) ◽  
Author(s):  
Joachim Jelken ◽  
Carsten Henkel ◽  
Svetlana Santer

Abstract We study the peculiar response of photo-sensitive polymer films irradiated with a certain type of interference pattern where one interfering beam is S-polarized, while the second one is P-polarized. The polymer film, although in a glassy state, deforms following the local polarization distribution of the incident light, and a surface relief grating (SRG) appears whose period is half the optical one. All other types of interference patterns result in the matching of both periods. The topographical response is triggered by the alignment of photo-responsive azobenzene containing polymer side chains orthogonal to the local electrical field, resulting in a bulk birefringence grating (BBG). We investigate the process of dual grating formation (SRG and BBG) in a polymer film utilizing a dedicated set-up that combines probe beam diffraction and atomic force microscopy (AFM) measurements, and permits acquiring in situ and in real-time information about changes in local topography and birefringence. We find that the SRG maxima appear at the positions of linearly polarized light (tilted by 45° relative to the grating vector), causing the formation of the half-period topography. This permits to inscribe symmetric and asymmetric topography gratings with sub-wavelength period, while changing only slightly the polarization of one of the interfering beams. We demonstrate an easy generation of sawtooth profiles (blazed gratings) with adjustable shape. With these results, we have taken a significant step in understanding the photo-induced deformation of azo-polymer films.


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