Engineering the Interaction Forces to Optimize CMP Performance

2002 ◽  
Vol 732 ◽  
Author(s):  
G. B. Basim ◽  
I. Vakarelski ◽  
P. Singh ◽  
B. M. Moudgil
Keyword(s):  
Material Removal ◽  
Surface Deformation ◽  
Defect Density ◽  
Removal Rate ◽  
Particle Interactions ◽  
Interaction Forces ◽  
High Performing ◽  
Optimal Material ◽  
Slurry Stability ◽  
The Impact

AbstractThe main objective of Chemical Mechanical Polishing (CMP) process is to planarize the metal or dielectric layers deposited on the wafer surfaces in microelectronics device manufacturing. In CMP, slurries containing submicrometer size particles and chemicals are used to achieve planarization. An effective polishing requires an optimal material removal rate with minimal surface deformation. Therefore, it is important to control the particle-substrate interactions that are responsible for the material removal and the particle-particle interactions, which control the slurry stability and consequently the defect density. This paper discusses the impact of interaction forces on polishing, and underlines the scientific guidelines to formulate consistently high performing CMP slurries.

Parametric Optimization of EN-31 Steel in Wire Cut Electro Discharge Machining by Taguchi Technique

2020 ◽  
Vol 12 (7) ◽  
pp. 881-887
Author(s):  
Sahil Sharma ◽  
Umesh Kumar Vates ◽  
Amit Bansal
Keyword(s):  
Material Removal Rate ◽  
Automobile Industry ◽  
Material Removal ◽  
Removal Rate ◽  
Dimensional Accuracy ◽  
Work Piece ◽  
Electro Discharge Machining ◽  
En 31 ◽  
The Impact ◽  
Dies And Moulds

Amongst the various methods of machining, Electro Discharge Machining is the convenient alternatives for the industries due to non-contact of work piece and tool. In the study of various EDM processes the main target is to achieve the better finish of surface, high material removal rate and good dimensional accuracy by regulating the different input parameters. There are various applications of EDM such as aerospace parts, medical equipments, dies and moulds, nuclear and automobile industry. In this experimental study, a trial has made to look the impact of input factors like pulse-on, pulse-off, peak current, tension of wire on rate of material removal, gap current and time for machining. Taguchi (L9 OA) and Analysis of Variance technique were used to optimize the outcomes for wire cut EDM of EN-31 tool steel. The outcomes revealed that Ton and Toff are the leading cogent factor for material removal rate and gap current respectively.

Understanding Selectivity on Germanium/SiO2 Chemical Mechanical Planarization Through Design of Experiments

2015 ◽  
Vol 1790 ◽  
pp. 19-24
Author(s):  
Ayse Karagoz ◽  
James Mal ◽  
G. Bahar Basim
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Active Agent ◽  
Chemical Mechanical Planarization ◽  
Sodium Dodecyl ◽  
Active Agent ◽  
High Mobility ◽  
High Removal Rate ◽  
The Impact

ABSTRACTThe continuous trend of achieving more complex microelectronics with smaller nodes yet larger wafer sizes in microelectronics manufacturing lead to aggressive development requirements for chemical mechanical planarization (CMP) process. Particularly, beyond the 14 nm technology the development needs made it a must to introduce high mobility channel materials such as Ge. CMP is an enabler for integration of these new materials into future devices. In this study, we implemented a design of experiment (DOE) methodology in order to understand the optimized CMP slurry parameters such as optimal concentration of surface active agent (sodium dodecyl sulfate-SDS), concentration of abrasive particles and pH from the viewpoint of high removal rate and selectivity while maintaining a defect free surface finish. The responses examined were particle size distribution (slurry stability), zeta potential, material removal rate (MRR) and the surface defectivity as a function of the selected design variables. The impact of fumed silica particle loadings, oxidizer (H2O2) concentration, SDS surfactant concentration and pH were analyzed on Ge/silica selectivity through material removal rate (MRR) surface roughness and defectivity analyses.

An Investigation of Factors Affecting and Optimizing Material Removal Rate in Computer Controlled Ultra-Precision Polishing

2014 ◽  
Vol 625 ◽  
pp. 446-452
Author(s):  
Lai Ting Ho ◽  
Chi Fai Cheung ◽  
Liam Blunt ◽  
Sheng Yue Zeng
Keyword(s):  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Orthopedic Implants ◽  
Polishing Process ◽  
Factors Affecting ◽  
Ultra Precision ◽  
Computer Controlled ◽  
The Impact

There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.

An experimental study on rotary ultrasonic machining of Macor ceramic

2016 ◽  
Vol 232 (7) ◽  
pp. 1221-1234 ◽  
Author(s):  
Ravi Pratap Singh ◽  
Sandeep Singhal
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Ultrasonic Power ◽  
Ultrasonic Machining ◽  
Rotary Ultrasonic Machining ◽  
Desirability Approach ◽  
Index Value ◽  
The Impact ◽  
Desirability Index

Macor ceramic has been well recognized as an eminent engineering material which possesses enlarged industrial usage owing to its excellent and versatile properties. However, its fruitful and economic processing is still unanswered. This article has targeted to experimentally investigate the influence of numerous process variables on machining characteristics in rotary ultrasonic machining of Macor ceramic. The impact of different input factors, namely, spindle speed, feed rate, coolant pressure, and ultrasonic power has been appraised on process responses of interest, that is, material removal rate and chipping size. The experimental plan was designed by employing response surface methodology through central composite rotatable design. The variance analysis test has also been performed with a view to observe the significance of considered parameters. Microstructure of machined samples has also been evaluated and analyzed using scanning electron microscope. This analysis has revealed and confirmed the presence of dominated brittle fracture that caused removal of material along with the thin plastic deformation in rotary ultrasonic machining of Macor ceramic. The reliability and competence of the developed mathematical model have been established with test results. The multi-response optimization of machining responses has also been done by utilizing desirability approach, and at optimized parametric setting, the obtained experimental values for material removal rate and chipping size are 0.4762 mm3/s and 0.3718 mm, respectively, with the combined desirability index value of 0.937.

scholarly journals Effect of Machine Feed Rate on Kerf-Width, Material Removal Rate, and Surface Roughness in Machining of Al/SiC Composite Material with Wire Electrical Discharge Machine

2020 ◽  
Vol 70 (1) ◽  
pp. 81-88
Author(s):  
Manoj Modi ◽  
Gopal Agarwal ◽  
Swati D Chaugaonkar ◽  
Umesh Bhatia ◽  
Veerendra Patil
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Electrical Discharge Machine ◽  
Kerf Width ◽  
Discharge Machine ◽  
Wire Electric Discharge Machining ◽  
The Impact

AbstractThe impact of machine feed rates of Wire Electric Discharge Machining on the kerf-width (K-width), material-removal-rate (MR-R), and surface-roughness (S-R) in the machining of Al/SiC composite is practically analysed. The relation among the feed rates of machine and K-width, MR-R, S-R is graphically acquired. It is demonstrated that lesser rate of feed is responsible for generation of larger K-width, lesser MR-R, and good finish as compared to more feed rate.

Influence of Process Parameters on Material Removal Rate in Electrical Discharge Machining Cylindrical Shaped Parts

2021 ◽  
Vol 1018 ◽  
pp. 91-95
Author(s):  
Tran Thi Hong ◽  
Nguyen Hong Linh ◽  
Bui Thanh Danh ◽  
Le Hong Ky ◽  
Vu Thi Lien ◽  
...  
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Pulse Current ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Work Piece ◽  
Influence Of Process Parameters ◽  
Pulse On Time ◽  
Pulse Off Time ◽  
The Impact

This paper aims to find the impact of Electric Discharge Machining (EDM) factors on material removal rate (MRR) for 90CrSi alloy steel. Five three-level factors including pulse on time (Ton), pulse off time (Toff), pulse current (IP), server voltage (SV), and diameter of work-piece (dw) are investigated to explore their contribution on MRR by using Taguchi method in twenty-seven experiments based on an orthogonal array L27 (35). The findings realize that MRR is the most affected by the pulse current while the effect of the dw is the smallest. Based on ANOVA analysis, an optimal model of MRR has been developed and verified by comparing with the experiment result. The applicability of this proposed method can be used for further studies in EDM process.

scholarly journals Application of Taguchi and RSM Parameters on Surface Roughness and Material Removal Rate of AA6082T6

2021 ◽  
Vol 2070 (1) ◽  
pp. 012211
Author(s):  
Harish Mugutkar ◽  
N. Tamiloli
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Feed Speed ◽  
Expulsion Rate ◽  
The Impact ◽  
Test Outcomes ◽  
Carbide Insert ◽  
The Ideal

Abstract Taguchi and Response Surface Methodologies (RSM) for Surface Roughness (SR), and Material Removal Rate (MRR) in end processing of AA6082T6 with tungsten carbide Insert. The Experiments have been driven using the Taguchi plan. The cutting boundaries are feed, speed, and profundity of cut. The impact of machining boundaries and to assessed the ideal cuttings condition to surface unpleasantness and material expulsion rate. A second-request model has been work between the cutting limits and the machining limits to recognize out the SR and MRR by using reaction surface strategy. The test outcomes have shown the most basic factor in the surface unpleasantness is speed (31.068%) and in the material evacuation rate is profundity of cut (51.9404%). The anticipated qualities are affirmed by utilizing affirmation tests.

scholarly journals Investigating the impact of chucks on the stability of a milling process

2021 ◽  
Vol 25 (5) ◽  
pp. 549-558
Author(s):  
A. S. Pyatykh ◽  
P. P. Shaparev
Keyword(s):  
Dynamic Stability ◽  
Material Removal ◽  
End Milling ◽  
Removal Rate ◽  
Milling Process ◽  
Numerical Control ◽  
End Mill ◽  
Solid Carbide ◽  
The Impact ◽  
Power Chuck

The impact of a tool chuck on the dynamic stability of a milling process with an end mill was investigated using a workpiece made of aluminium wrought alloy V95pchT2. To assess the dynamic stability, we analysed a Fourier transformed signal recorded during milling using a Shure PGA81 -XLR tool directional microphone. The milling was performed on an HSC75 linear high-production machining centre with an H10F solid carbide end mill. Cutting conditions were calculated based on a stability diagram derived from an operational modal analysis of a manufacturing system. The surface roughness was measured with a Taylor Hobson Form Talysurf i200 contact profilometer. Performance defined by the rate of material removal and the roughness of a treated surface was used to evaluate the cutting process. A correlation was found between the type of tool chuck fixating the end mill, the rate of material removal and the roughness of the machined surface. It was found that, for milling using a power chuck, the areas of stable cutting correspond to the max imum cutting depth equal to 5.6 mm at a cutting width of 16 mm and a cutting feed of 0.1 mm/rev. However, for the other studied chucks, this indicator was 20 to 30% lower. End milling conducted using a power chuck with a solid carbide cutter with a diameter of 16 mm and three cutting teeth resulted in dynamically stable cutting with the highest material removal rate (575.6 cm3/min) and minimum surface roughnes s (0.56 μm). Based on the conducted analysis, for the operation of end milling on a machine with computerised numerical control (CNC), a power tool chuck is recommended that improves milling performance by over 25% relative to the considered tool setups. Furthermore, this preserves the quality of a treated surface and increases the tool cutting life owing to dynamically stable cutting.

A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives

2017 ◽  
Vol 139 (8) ◽  
Author(s):  
Sagil James ◽  
Murali Sundaram
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Dynamics Simulation ◽  
Common Mechanism ◽  
Initial Kinetic Energy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
The Impact

Vibration assisted nano impact-machining by loose abrasives (VANILA) is a novel nanomachining process to perform target-specific nano abrasive machining of hard and brittle materials. In this study, molecular dynamic (MD) simulations are performed to understand the nanoscale material removal mechanisms involved in the VANILA process. The simulation results revealed that the material removal for the given impact conditions happens primarily in ductile mode through three distinct mechanisms, which are nanocutting, nanoplowing, and nanocracking. It was found that domination by any of these mechanisms over the other mechanisms during the material removal process depends on the impact conditions, such as angle of impact and the initial kinetic energy of the abrasive grain. The transition zone from nanocutting to nanoplowing is observed at angle of impact of near 60 deg, while the transition from the nanocutting and nanoplowing mechanisms to nanocracking mechanism is observed for initial abrasive kinetic energies of about 600–700 eV. In addition, occasional lip formation and material pile-up are observed in the impact zone along with amorphous phase transformation. A material removal mechanism map is constructed to illustrate the effects of the impacts conditions on the material removal mechanism. Confirmatory experimentation on silicon and borosilicate glass substrates showed that all the three nanoscale mechanisms are possible, and the nanoplowing is the most common mechanism. It was also found that the material removal rate (MRR) values are found to be highest when the material is removed through nanocracking mechanism and is found to be lowest when the material removal happens through nanocutting mechanism.

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