GaAs Circuit Restructuring by Multi-Level Laser-Direct-Written Tungsten Process
Keyword(s):
AbstractLaser-direct-writing processes are employed to fabricate a GaAs digital integrated circuit. The lithography-free techniques deposit and etch conductors and resistors, and remove insulating layers, thus enabling multilevel interconnections. These combined directwrite processes provide the flexibility of clip-lead prototyping on a micrometer scale.
