In-Situ Infrared (IR) Detection and Heating of the High Pressure Phase of Silicon during Scratching Test

2004 ◽  
Vol 841 ◽  
Author(s):  
Lei Dong ◽  
John A. Patten ◽  
Jimmie A. Miller

ABSTRACTA novel method of in-situ detection of the high pressure phase transformation of silicon during dead-load scratching is described. The method is based on the simple fact that single crystal silicon is transparent to Infrared light while metallic materials are not. Infrared heating during scratching has been performed to thermally soften and deform the transformed metallic material and some promising results were obtained. The sample material used here is silicon, but the same approach can be applied to germanium and other materials, such as ceramics (SiC), which have appropriate optical properties.

2004 ◽  
Vol 843 ◽  
Author(s):  
Lei Dong ◽  
John A. Patten ◽  
Jimmie A. Miller

ABSTRACTA novel method of in-situ detection of the high pressure phase transformation of silicon during dead-load scratching is described. The method is based on the simple fact that single crystal silicon is transparent to Infrared light while metallic materials are not. Infrared heating during scratching has been performed to thermally soften and deform the transformed metallic material and some promising results were obtained. The sample material used here is silicon, but the same approach can be applied to germanium and other materials, such as ceramics (SiC), which have appropriate optical properties.


2004 ◽  
Vol 127 (3) ◽  
pp. 522-532 ◽  
Author(s):  
John Patten ◽  
Wei Gao ◽  
Kudo Yasuto

We have demonstrated the ability to perform a ductile material removal operation, via single-point diamond turning, on single-crystal silicon carbide (6H). To our knowledge, this is the first reported work on the ductile machining of single-crystal silicon carbide (SiC). SiC experiences a ductile-to-brittle transition similar to other nominally brittle materials such as silicon, germanium, and silicon nitride. It is believed that the ductility of SiC during machining is due to the formation of a high-pressure phase at the cutting edge, which encompasses the chip formation zone and its associated material volume. This high-pressure phase transformation mechanism is similar to that found with other semiconductors and ceramics, leading to a plastic response rather than brittle fracture at small size scales.


2002 ◽  
Vol 106 (1) ◽  
pp. 30-33 ◽  
Author(s):  
Hiroyasu Shimizu ◽  
Tatsuya Kumazaki ◽  
Tetsuji Kume ◽  
Shigeo Sasaki

2019 ◽  
Vol 36 (4) ◽  
pp. 046103 ◽  
Author(s):  
Sheng Jiang ◽  
Jing Liu ◽  
Xiao-Dong Li ◽  
Yan-Chun Li ◽  
Shang-Ming He ◽  
...  

1999 ◽  
Vol 84 (1-2) ◽  
pp. 203-206 ◽  
Author(s):  
Yingwei Fei ◽  
Daniel J. Frost ◽  
Ho-Kwang Mao ◽  
Charles T. Prewitt ◽  
Daniel Haeusermann

2017 ◽  
Vol 102 (3) ◽  
pp. 666-673 ◽  
Author(s):  
Anna Pakhomova ◽  
Leyla Ismailova ◽  
Elena Bykova ◽  
Maxim Bykov ◽  
Tiziana Boffa Ballaran ◽  
...  

2008 ◽  
Vol 1146 ◽  
Author(s):  
Simon Ruffell ◽  
Jodie Bradby ◽  
Jim Williams ◽  
Ryan Major ◽  
Oden Warren

AbstractPhase transformed zones of silicon have been formed by nanoindentation both at the micro- and nanoscale and electrically probed using an in-situ measurement system. Zones composed of the high pressure crystalline phases (Si-III/Si-XII) have higher conductivity than those of amorphous silicon (a-Si). At the microscale probing laterally across the surface shows that the conductivity varies within the zones composed of the high pressure phases. The sensitivity to the different conductivities of the two phases allows mapping within the zones. Finally, at the nanoscale the conductivity of the high pressure phase zones can be correlated with the position of the pop-out associated with the formation of the phases. The zones have higher conductivity when the pop-out occurs earlier on unloading and we suggest that this is due to the reduction in trace volumes of a-Si formed during the early portion of the unloading cycle.


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