scholarly journals Study of Temperature Effect on Luminous Flux of High Power Chip on Board Light Emitting Diode

2014 ◽  
Vol 24 (3) ◽  
pp. 267
Author(s):  
Cao Xuan Quan ◽  
Vu Khanh Xuan ◽  
Luu Thi Lan Anh ◽  
Vo Thach Son
Keyword(s):  
Solid State ◽  
Temperature Effect ◽  
Measurement System ◽  
High Power ◽  
Light Emitting Diode ◽  
Flux Measurement ◽  
Luminous Flux ◽  
Light Emitting

High power chip on board light emitting diode (HPCOBLED) are a promising solid state light technology for a variety of lighting applications. In this study, we studied temperature effect on luminous flux of HPCOBLED using VMI-PR-001 system of Vietnam Metrology Institute. The results according to the temperature Tc is increasing, luminous flux reduced. Especially HPCOBLED is larger power, decreasing luminous flux is larger. Reason of this is chance power.   HPCOBLED model describes the temperature affection on luminous flux of HPCOBLED. The results of HPCOBLED model matched with that measured by the luminous flux measurement system (VMI-PR-001, Vietnam).

Wafer-Level Light Emitting Diode (WL-LED) Chip Simplified Package for Very-High Power Solid-State Lighting (SSL) Source

2016 ◽  
Vol 37 (2) ◽  
pp. 197-200 ◽  
Author(s):  
Yibin Zhang ◽  
Jianwei Xu ◽  
Mingdi Ding ◽  
Desheng Zhao ◽  
Hongjuan Huang ◽  
...  
Keyword(s):  
Solid State ◽  
High Power ◽  
Light Emitting Diode ◽  
Solid State Lighting ◽  
Wafer Level ◽  
Light Emitting ◽  
Very High

scholarly journals The Development of LED-Based Dental Light Using a Multiplanar Reflector Design

2014 ◽  
Vol 2014 ◽  
pp. 1-6
Author(s):  
Chi-Chang Hsieh ◽  
Yan-Huei Li
Keyword(s):  
Energy Consumption ◽  
Energy Saving ◽  
High Power ◽  
Light Emitting Diode ◽  
Luminous Flux ◽  
International Standards ◽  
Light Sources ◽  
Light Emitting ◽  
Standards And Regulations ◽  
Reduce Energy Consumption

A multiplanar reflector was designed to enhance the application efficiency of light-emitting diode (LED) light sources that can be employed as LED-based dental lights. This study used a high-power LED developed by Nichia, that is, a single LED capable of providing a total luminous flux of 120 lm, as the primarily light source to design and develop an LED-based dental light. This LED complies with the international standards and regulations stipulated in ISO 9680:2007. The light spots produced by the prototype were rectangular, with a length of 200 mm and a width of 100 mm. These light spots achieved maximum illumination of 12,000 lux. The use of LEDs can reduce energy consumption from 50 W to 3 W, providing an energy saving of more than 90%.

Phosphor concentration and geometry for high power white light emitting diode

2010 ◽  
Author(s):  
Kyung-Mi Moon ◽  
Se-Hwan An ◽  
Hyung-Kun Kim ◽  
Jung-Hye Chae ◽  
Yong-Jo Park
Keyword(s):  
White Light ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting

High-Power CW Operation of GaInAsP/InP Superluminescent Light-Emitting Diode with Tapered Active Region

2001 ◽  
Vol 40 (Part 2, No. 7A) ◽  
pp. L678-L680 ◽  
Author(s):  
Takeshi Yamatoya ◽  
Shigeaki Sekiguchi ◽  
Fumio Koyama ◽  
Kenichi Iga
Keyword(s):  
Active Region ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting ◽  
Cw Operation

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

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