High-speed non-invasive thermal analysis of high-power light-emitting diode arrays

2010 ◽  
Author(s):  
Nicholas M. Rada
Keyword(s):  
Thermal Analysis ◽  
High Power ◽  
High Speed ◽  
Light Emitting Diode ◽  
Light Emitting ◽  
Non Invasive

Thermal analysis of high power GaN-based light emitting diode

2007 ◽  
Author(s):  
Debo Guo ◽  
Libin Wang ◽  
Zhiqiang Liu ◽  
Meng Liang ◽  
Manning Fan ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting

Thermal Analysis of High-Power Light-Emitting Diode Using Thermoreflectance Thermography

2021 ◽  
Author(s):  
Dazheng Wang ◽  
Libing Zheng ◽  
Weikang Si ◽  
He Yang ◽  
Yingying Gao
Keyword(s):  
Thermal Analysis ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting

Simulation Research on the Heat Dissipation Performance of a High Power LED Radiator

2012 ◽  
Vol 224 ◽  
pp. 389-394
Author(s):  
Shu Zhen Jiang ◽  
Zhong Ning Guo ◽  
Yu Deng
Keyword(s):  
Thermal Analysis ◽  
Life Span ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Environment Friendly ◽  
Simulation Research ◽  
Light Emitting ◽  
High Power Led ◽  
Long Life

Applied in illumination area, high power LED (Light Emitting Diode) has a series of advantages with energy saving, environment-friendly, long life span, etc. However, the heat dissipation of the LED is a bottleneck in its development, and has become a key point which must be studied and solved urgently. In this paper, a typical LED lamp is modeled and thermal analysis has been performed using the software of Ansys.

Phosphor concentration and geometry for high power white light emitting diode

2010 ◽  
Author(s):  
Kyung-Mi Moon ◽  
Se-Hwan An ◽  
Hyung-Kun Kim ◽  
Jung-Hye Chae ◽  
Yong-Jo Park
Keyword(s):  
White Light ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting

High-Power CW Operation of GaInAsP/InP Superluminescent Light-Emitting Diode with Tapered Active Region

2001 ◽  
Vol 40 (Part 2, No. 7A) ◽  
pp. L678-L680 ◽  
Author(s):  
Takeshi Yamatoya ◽  
Shigeaki Sekiguchi ◽  
Fumio Koyama ◽  
Kenichi Iga
Keyword(s):  
Active Region ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting ◽  
Cw Operation

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

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