Cinch and Sterling Analog Circuits for Laboratory

As we know that there is ever increasing demand for compact circuits and less complex wirings over the board, a technological boon evolved for such demand is Printed Circuit Board (PCB). A PCB will mechanically supports and electrically connects electronic components using conductive tracks, pads. These boards will have minimal chances for short circuits, components on the board are fixed; another advantage is creation of multiple boards using single design. Taking this technology forward to our everyday life, we implemented analog communication laboratory circuit, Schmitt trigger.

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Numerical Model to Simulate the Drop Test of Printed Circuit Board (PCB)

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.423.26 ◽

2011 ◽

Vol 423 ◽

pp. 26-30

Author(s):

S. Assif ◽

M. Agouzoul ◽

A. El Hami ◽

O. Bendaou ◽

Y. Gbati

Keyword(s):

Solder Joint ◽

Printed Circuit Board ◽

Drop Test ◽

Dynamic Responses ◽

Circuit Board ◽

Joint Stress ◽

Printed Circuit ◽

Increasing Demand ◽

Improved Model ◽

Board Level

Increasing demand for smaller consumer electronic devices with multi-function capabilities has driven the packaging architectures trends for the finer-pitch interconnects, thus increasing chances of their failures. A simulation of the Board Level Drop-Test according to JEDEC (Joint Electron Device Council) is performed to evaluate the solder joint reliability under drop impact test. After good insights to the physics of the problem, the results of the numerical analysis on a simple Euler-Bernoulli beam were validated against analytical analysis. Since the simulation has to be performed on ANSYS Mechanical which is an implicit software, two methods were proposed, the acceleration-input and the displacement-input. The results are the same for both methods. Therefore, the simulation is carried on the real standard model construction of the board package level2. Then a new improved model is proposed to satisfy shape regular element and accuracy. All the models are validated to show excellent first level correlation on the dynamic responses of Printed Circuit Board, and second level correlation on solder joint stress. Then a static model useful for quick design analysis and optimization’s works is proposed and validated. Finally, plasticity behavior is introduced on the solder ball and a non-linear analysis is performed.

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Fuzzy inference filter and morphological operators for short circuits detection in printed circuit board

Proceedings of the IEEE International Symposium on Industrial Electronics ISIE-02 ◽

10.1109/isie.2002.1026372 ◽

2002 ◽

Cited By ~ 8

Author(s):

Voci ◽

Eiho ◽

Sugimoto

Keyword(s):

Printed Circuit Board ◽

Fuzzy Inference ◽

Circuit Board ◽

Morphological Operators ◽

Printed Circuit ◽

Short Circuits

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Universal synthesis of conductive liquid network in polymers enabling elastic printed circuit board technology

10.21203/rs.3.rs-1130783/v1 ◽

2021 ◽

Author(s):

Jiheong Kang ◽

Wonbeom Lee ◽

Hyunjun Kim ◽

Inho Kang ◽

Hongjun Park ◽

...

Keyword(s):

Liquid Metal ◽

Acoustic Field ◽

Printed Circuit Board ◽

Circuit Board ◽

System Level ◽

Large Strains ◽

Stretchable Electronics ◽

Electronic Components ◽

Conductive Liquid ◽

Printed Circuit

Abstract Stretchable electronics are considered next-generation electronic devices in a broad range of emerging fields, including soft robotics1,2, biomedical devices3,4, human-machine interfaces5,6, and virtual or augmented reality devices7,8. A stretchable printed circuit board (S-PCB) is a basic conductive framework for the facile assembly of system-level stretchable electronics with various electronic components. Since an S-PCB is responsible for electrical communications between numerous electronic components, the conductive lines in S-PCB should strictly satisfy the following features: (i) metallic conductivity, (ii) constant electrical resistance during dynamic stretching, and (iii) tough interface bonding with various components9. Despite recent significant advances in intrinsically stretchable conductors10,11,12, they cannot simultaneously satisfy the above stringent requirements. Here, we present a new concept of conductive liquid network-based elastic conductors. These conductors are based on unprecedented liquid metal particles assembled network (LMPNet) and an elastomer. The unique assembled network structure and reconfigurable nature of the LMPNet conductor enabled high conductivity, high stretchability, tough adhesion, and imperceptible resistance changes under large strains, which enabled the first elastic-PCB (E-PCB) technology. We synthesized LMPNet through an acoustic field-driven cavitation event in the solid state. When an acoustic field is applied, liquid metal nanoparticles (LMPnano) are remarkably generated from original LMPs and assemble into a highly conductive particle network (LMPNet). Finally, we demonstrated a multi-layered E-PCB, in which various electronic components were integrated with tough adhesion to form a highly stretchable health monitoring system. Since our synthesis of LMPNet is universal, we could synthesize LMPNet in various polymers, including hydrogel, self-healing elastomer and photoresist and add new functions to LMPNet.

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Thermal and Electrical Analysis of Solid Aluminium Capacitors

Active and Passive Electronic Components ◽

10.1155/1987/46158 ◽

1987 ◽

Vol 12 (3) ◽

pp. 167-186 ◽

Cited By ~ 1

Author(s):

E. H.L.J. Dekker ◽

C. J.M. Lasance

Keyword(s):

Thermal Properties ◽

Printed Circuit Board ◽

Circuit Board ◽

Electronic Components ◽

Reverse Voltage ◽

Printed Circuit ◽

Electrolytic Capacitors ◽

Extensive Analysis ◽

Current Specification ◽

Electrical Analysis

The thermal properties of electronic components partly determine the reliability of electronic equipment. For electrolytic capacitors, they also set the limits for the ripple current and voltage values.This article first discusses the voltage limits under various conditions of temperature, frequency and polarity. Then the connection of ripple current to these parameters and to the capacitor's resistance is treated.An extensive analysis is made of the influence of heat conduction in the capacitor and the printed-circuit board, for metal-cased as well as for epoxy-coated pearl types. The study pays particular attention to solid aluminium capacitors containing a manganese dioxide semiconductor. They have some extraordinary properties: a temperature range of at least – 80 to + 175℃, and an appreciable reverse voltage potential.These can be fully employed to improve the ripple-current specification.

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Realistic warpage evaluation of printed board assembly during reflow process

Soldering & Surface Mount Technology ◽

10.1108/ssmt-12-2014-0023 ◽

2015 ◽

Vol 27 (4) ◽

pp. 137-145 ◽

Cited By ~ 10

Author(s):

Soonwan Chung ◽

Jae B. Kwak

Keyword(s):

Numerical Simulation ◽

Boundary Conditions ◽

Printed Circuit Board ◽

Circuit Board ◽

Contact Boundary ◽

Electronic Components ◽

Reflow Process ◽

Common Component ◽

Content Type ◽

Printed Circuit

Purpose – This paper aims to develop an estimation tool for warpage behavior of slim printed circuit board (PCB) array while soldering with electronic components by using finite element method. One of the essential requirements for handheld devices, such as smart phone, digital camera, and Note-PC, is the slim design to satisfy the customers’ desires. Accordingly, the printed circuit board (PCB) should be also thinner for a slim appearance, which would result in decreasing the PCB’s bending stiffness. This means that PCB deforms severely during the reflow (soldering) process where the peak temperature goes up to 250°C. Therefore, it is important to estimate PCB deformation at a high temperature for thermo-mechanical quality/reliability after reflow process. Design/methodology/approach – A numerical simulation technique was devised and customized to accurately estimate the behavior of a thin printed board assembly (PBA) during reflow by considering all components, including PCB, microelectronic packages and solder interconnects. Findings – By applying appropriate constraints and boundary conditions, it was found that PBA’s warpage can be accurately predicted during the reflow process. The results were also validated by warpage measurement, which showed a fairly good agreement with one and another. Research limitations/implications – For research limitations, there are many assumptions regarding numerical modeling. That is, the viscoplastic material property of solder ball is ignored, the reflow profile is simplified and the accurate heat capacity is not considered. Furthermore, the residual stress within the PCB, generated at PCB manufacturing process, is not included in this paper. Practical implications – This paper shows how to calculate PBA warpage during the reflow process as accurately as possible. This methodology helps a PCB designer and surface-mount technology (SMT) process manager to predict a PBA warpage issue and modify PCB design before PCB real fabrication. Practically, this modeling and simulation process can be easily performed by using a graphical user interface (GUI) module, so that the engineer can handle an issue by inputting some numbers and clicking some buttons. Social implications – In a common sense manner, a numerical simulation method can decrease time and cost in manufacturing real samples. This PCB warpage method can also decrease product development duration and produce a new product earlier. Furthermore, PCB is a common component in all the electronic devices. So, this PCB warpage method can have various applications. Originality/value – Because of an economic advantage, the development of a numerical simulation tool for estimating the thin PBA warpage behaviour during reflow process was attempted. The developed tool contains the features of detailed modeling for electronic components and contact boundary conditions of the supporting rails in the reflow oven.

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