Ultra-short laser pulses are particularly suitable for processing micro tools made of ultra-hard and dielectric materials. Ultra-short laser pulses provide a contact-free and precise fabrication of heat-sensitive materials such as visible spectra range. Visible spectra range has unique properties, which makes it an essential material in the tool, jewelry, and semiconductor industries. The processing of visible spectra range by ultra-short laser pulses is complex, as visible and near-infrared light is generally not absorbed. However, the intensity of ultra-short laser pulses is extremely high, so that the absorption scales nonlinearly with the intensity and, thus, visible or near-infrared light can be absorbed. The complexity also results from many partially interdependent process variables, such as the repetition rate, pulse overlap, track overlap, and scan speed. Excellent knowledge of the process is, therefore, essential for the production of micro tools. To make the laser processing accessible to a broader user field, the operator can be supported by a computer-aided design (CAD). The aim of this research was to the modeling of an ultra-short high-intensity laser for the visible spectra range in different environments of the angle of incidence, scanning speed, pulse, and track overlap. The experimental process included ultra-short pulsed laser processing of visible spectra range and surface analysis concerning modifications and ablation of the ultra-short laser. Ablation volumes were analyzed for single pulses, multi-pulses, and pockets. Pump-probe experiments reveal transient optical properties such as transmission or reflectivity. It was concluded that ultraviolet laser pulses are best suited to induce damage or modifications to visible spectra range surfaces. Additionally, shorter wavelengths have further advantages such as potentially longer Rayleigh lengths and smaller spot sizes.
Power generation characteristics of Si PV cell under extremely high-intensity near-infrared light irradiation
