ON-CHIP HIGH PRECISION RC AND LC OSCILLATORS WITH DIGITAL COMPENSATION TECHNIQUE IN 45nm

2019 ◽  
Vol 21 (1-2) ◽  
pp. 9-20
Author(s):  
G. K. Mounica ◽  
M. Madhu Babu ◽  
S. S. Chinta Sarma
Keyword(s):  
High Precision ◽  
Digital Compensation ◽  
Lc Oscillators ◽  
Compensation Technique ◽  
On Chip

A High-Precision Wide Range On-Chip Path Delay Measurement

2014 ◽  
Vol 11 (9) ◽  
pp. 450-454
Author(s):  
Neelufar Naheed Saudagar ◽  
◽  
Seema Deshmukh
Keyword(s):  
High Precision ◽  
Path Delay ◽  
Delay Measurement ◽  
Wide Range ◽  
On Chip

scholarly journals An On-Chip PVT Compensation Technique with Current Monitoring Circuit for Low-Voltage CMOS Digital LSIs

2010 ◽  
Vol E93-C (6) ◽  
pp. 835-841 ◽  
Author(s):  
Yusuke TSUGITA ◽  
Ken UENO ◽  
Tetsuya HIROSE ◽  
Tetsuya ASAI ◽  
Yoshihito AMEMIYA
Keyword(s):  
Low Voltage ◽  
Compensation Technique ◽  
On Chip ◽  
Current Monitoring

Electro-Fluidic Packaging for CMOS Based Laboratory-on-Chips

2006 ◽  
Author(s):  
Ebrahim Ghafar-Zadeh ◽  
Mohamad Sawan ◽  
Daniel Therriault
Keyword(s):  
Epoxy Resin ◽  
High Precision ◽  
Three Dimensional ◽  
Fabrication Process ◽  
Moderate Temperature ◽  
Direct Write ◽  
Deposition Technique ◽  
Experimental Section ◽  
Cmos Chip ◽  
On Chip

Direct-write fabrication process (DWFP) is a robotic deposition technique used to produce planar or three-dimensional (3D) microscale structures. These structures consist of paste-like filaments which are extruded through a micronozzle and deposited on a substrate [1]. These filaments are encapsulated inside an epoxy resin and then melted and removed by applying a moderate temperature for the creation of microfluidic components (e.g., microchannels, reservoirs). Following our previous reports [2–3] on the fabrication of microchannels by DWFP and high precision CMOS capacitive sensors [4], we present in this paper a microfluidic packaging procedure to realize microchannel and fluidic connections on top of CMOS chip. The compatibility of this fluidic packaging procedure with conventional electrical packaging techniques (e.g. wire bonding) is an important advantage of DWFP for CMOS based Laboratory-On-Chip applications. The fabrication challenges are discussed in the experimental section.

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