Electronic Equipment Reliability Data,

1986 ◽  
Author(s):  
William A. Cesare ◽  
Susan B. Stockman
Keyword(s):  
Electronic Equipment ◽  
Reliability Data ◽  
Equipment Reliability

Data Center Equipment Reliability Concerns—Contamination Issues, Standards Actions, and Case Studies

2013 ◽  
Author(s):  
Chris Muller ◽  
Chuck Arent ◽  
Henry Yu
Keyword(s):  
Case Studies ◽  
Data Center ◽  
Data Centers ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Lead Free ◽  
Reliable Operation ◽  
Contamination Assessment ◽  
Equipment Reliability ◽  
Equipment Failures

Abstract Lead-free manufacturing regulations, reduction in circuit board feature sizes and the miniaturization of components to improve hardware performance have combined to make data center IT equipment more prone to attack by corrosive contaminants. Manufacturers are under pressure to control contamination in the data center environment and maintaining acceptable limits is now critical to the continued reliable operation of datacom and IT equipment. This paper will discuss ongoing reliability issues with electronic equipment in data centers and will present updates on ongoing contamination concerns, standards activities, and case studies from several different locations illustrating the successful application of contamination assessment, control, and monitoring programs to eliminate electronic equipment failures.

Mechanical Engineering Issues and Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits

1991 ◽  
Vol 113 (1) ◽  
pp. 1-7 ◽  
Author(s):  
C. T. Leonard
Keyword(s):  
Electronic Equipment ◽  
Major Influence ◽  
Reliability Models ◽  
Temperature Reduction ◽  
Equipment Reliability ◽  
Electronics Reliability ◽  
Significant Temperature ◽  
Failure Avoidance ◽  
Electronic Parts ◽  
The Cost

Temperature is widely viewed as a major influence on failures of electronic equipment. Failure Prediction Methodology (FPM), such as MIL-HDBK-217 is an often quoted reference describing the temperature influence, often depicted as being exponential in effect, affecting wide classes of electronic component parts. The FPM concept of a constant failure rate that is accelerated by various environmental influences is widely applied beyond its validity. Misapplications of the reliability models in current use may cause failure avoidance efforts such as temperature reduction and parts quality selections not to yield anticipated overall results. The cost and complexity effects can be significant: temperature reduction, for example, can result in expensive system implementations in some cases whose costs and complexities may exceed the anticipated benefits in reliability. Due to industry wide continuing improvements in component quality over the years, the continuing quest for electronics reliability should change emphasis from attention to electronic parts to activities that address assembly and processes. This paper discusses the ways the temperature ingredient of reliability and similar concepts may be currently applied, with examples to illustrate disparities between anticipations and realizations. Alternate approaches are offered and their possible implementations are discussed.

Design for electronic equipment reliability in complex systems

2010 ◽  
Vol 12 (1) ◽  
pp. 84 ◽  
Author(s):  
Guillaume Poncelin ◽  
Aline Cauvin ◽  
Mathieu Glade ◽  
Patrick Lyonnet ◽  
Denis Dufrene
Keyword(s):  
Complex Systems ◽  
Electronic Equipment ◽  
Equipment Reliability

Deterministic Failure Prediction

1987 ◽  
Vol 30 (2) ◽  
pp. 34-36
Author(s):  
Alan Burkhard
Keyword(s):  
Stress Condition ◽  
Failure Prediction ◽  
Probability Of Failure ◽  
Electronic Equipment ◽  
Reliability Prediction ◽  
Structural Systems ◽  
Equipment Reliability ◽  
Physical Laws ◽  
Metallurgical Processes

This paper presents an approach to equipment reliability prediction based on the concept that failures of electronic equipment are ultimately due to chemical, mechanical and/or metallurgical processes. These processes follow physical laws which can be modeled and the amount of life available for exposure to a given stress condition can be calculated. Using this approach, a failure-free operational period can be calculated during which, for all practical purposes, the probability of failure is essentially zero. Such an approach is used to design structural systems such as airframes, bridges, etc. But to implement such an approach will require a change in mindset and philosophy in terms of how avionics reliability and failures are considered. This paper presents concepts and ideas of how this can be and is beginning to be implemented.

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Levente Klein ◽  
Dereje Agonafer ◽  
Jimil M. Shah ◽  
Kanan D. Pujara
Keyword(s):  
Information Technology ◽  
High Temperature ◽  
Relative Humidity ◽  
Data Center ◽  
Data Centers ◽  
Electronic Equipment ◽  
Worst Case ◽  
Equipment Reliability ◽  
Short Period ◽  
Temperature And Humidity

The energy used by information technology (IT) equipment and the supporting data center equipment keeps rising as data center proliferation continues unabated. In order to contain the rising computing costs, data center administrators are resorting to cost cutting measures such as not tightly controlling the temperature and humidity levels and in many cases installing air side economizers with the associated risk of introducing particulate and gaseous contaminations into their data centers. The ASHRAE TC9.9 subcommittee, on Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment, has accommodated the data center administrators by allowing short period excursions outside the recommended temperature-humidity range, into allowable classes A1-A3. Under worst case conditions, the ASHRAE A3 envelope allows electronic equipment to operate at temperature and humidity as high as 24°C and 85% relative humidity for short, but undefined periods of time. This paper addresses the IT equipment reliability issues arising from operation in high humidity and high temperature conditions, with particular attention paid to the question of whether it is possible to determine the all-encompassing x-factors that can capture the effects of temperature and relative humidity on equipment reliability. The role of particulate and gaseous contamination and the aggravating effects of high temperature and high relative humidity will be presented and discussed. A method to determine the temperature and humidity x-factors, based on testing in experimental data centers located in polluted geographies, will be proposed.

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