scholarly journals CURIUM PROCESS DEVELOPMENT. III-6. CHARACTERIZATION OF EMULSIONS FORMED IN CURIUM SOLVENT EXTRACTION.

1970 ◽  
Author(s):  
D.A. Brown ◽  
A.L. Marston

Author(s):  
H. Sur ◽  
S. Bothra ◽  
Y. Strunk ◽  
J. Hahn

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.



1998 ◽  
Vol 70 (22) ◽  
pp. 4841-4846 ◽  
Author(s):  
Jan Nygren ◽  
Abdalla Elbergali ◽  
Mikael Kubista


2014 ◽  
Vol 111 (12) ◽  
pp. 2486-2498 ◽  
Author(s):  
Georgina Espuny Garcia del Real ◽  
Jim Davies ◽  
Daniel G. Bracewell


Author(s):  
Kirubanandan Shanmugam ◽  
Deepak Kumar Verma ◽  
Mamta Thakur ◽  
Ramandeep Kaur ◽  
Kawaljit Singh Sandhu ◽  
...  


Talanta ◽  
2018 ◽  
Vol 188 ◽  
pp. 763-771 ◽  
Author(s):  
Jashbir Singh ◽  
G.K. Jayaprakasha ◽  
Bhimanagouda S. Patil
Keyword(s):  


Author(s):  
Duraisamy Abinaya ◽  
Jayaprakash Harshini ◽  
Natarajan Narayanan ◽  
Dhayalan Manikandan ◽  
Dineshkumar SenthilKumar


2018 ◽  
Vol 190 ◽  
pp. 11005 ◽  
Author(s):  
Marco Posdzich ◽  
Rico Stöckmann ◽  
Florian Morczinek ◽  
Matthias Putz

Burnishing is an effective chipless finishing process for improving workpiece properties: hardness, vibration resistance and surface quality. The application of this technology is limited to rotationally symmetrical structures of deformable metals. Because of the multiaxial characteristics, the transfer of this force controlled technology on to prismatic shapes requires a comprehensive process development. The main purpose of this paper is the characterization of a plain burnishing process on aluminium EN AW 2007 with a linear moved, spherical diamond tool. The method of design of experiments was used to investigate the influence of different machined surfaces in conjunction with process parameters: burnishing force, burnishing direction, path distance and burnishing speed. FEM simulation was utilized for strain and stress analysis. The experiments show, that unlike the process parameters the initial surface roughness as 3rd order shape deviation does not have a significant influence on the finished surface. Furthermore a completely new surface is created by the process, with properties independent from the initial surface roughness.



2009 ◽  
Vol 23 (9) ◽  
pp. 4553-4561 ◽  
Author(s):  
Josefa M. Griffith ◽  
Caroline E. Burgess Clifford ◽  
Leslie R. Rudnick ◽  
Harold H Schobert


Sign in / Sign up

Export Citation Format

Share Document