scholarly journals Fabrication of Stable, Large-Area, Thin-Film CdTe Photovoltaic Modules, Annual Subcontract Report, 10 May 1991 - 9 May 1992

1992 ◽  
Author(s):  
J. F. Nolan ◽  
P. V. Meyers
2011 ◽  
Vol 20 (4) ◽  
pp. 416-422 ◽  
Author(s):  
Mauro Pravettoni ◽  
Anika Komlan ◽  
Roberto Galleano ◽  
Harald Müllejans ◽  
Ewan D. Dunlop

2007 ◽  
Vol 2007 ◽  
pp. 1-6 ◽  
Author(s):  
Michael Powalla ◽  
Dieter Bonnet

Thin-film photovoltaic modules based on Cu-In-Ga-Se-S (CIS) and CdTe are already being produced with high-quality and solar conversion efficiencies of around 10%, with values up to 14% expected in the near future. The integrated interconnection of single cells into large-area modules of 0.6×1.2m2 enables low-cost mass production, so that thin-film modules will soon be able to compete with conventional silicon-wafer-based modules. This contribution provides an overview of the basic technologies for CdTe and CIS modules, the research and development (R&D) issues, production technology and capacities, the module performance in long-term outdoor testing, and their use in installations.


2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yuki Tsuruma ◽  
Emi Kawashima ◽  
Yoshikazu Nagasaki ◽  
Takashi Sekiya ◽  
Gaku Imamura ◽  
...  

AbstractPower devices (PD) are ubiquitous elements of the modern electronics industry that must satisfy the rigorous and diverse demands for robust power conversion systems that are essential for emerging technologies including Internet of Things (IoT), mobile electronics, and wearable devices. However, conventional PDs based on “bulk” and “single-crystal” semiconductors require high temperature (> 1000 °C) fabrication processing and a thick (typically a few tens to 100 μm) drift layer, thereby preventing their applications to compact devices, where PDs must be fabricated on a heat sensitive and flexible substrate. Here we report next-generation PDs based on “thin-films” of “amorphous” oxide semiconductors with the performance exceeding the silicon limit (a theoretical limit for a PD based on bulk single-crystal silicon). The breakthrough was achieved by the creation of an ideal Schottky interface without Fermi-level pinning at the interface, resulting in low specific on-resistance Ron,sp (< 1 × 10–4 Ω cm2) and high breakdown voltage VBD (~ 100 V). To demonstrate the unprecedented capability of the amorphous thin-film oxide power devices (ATOPs), we successfully fabricated a prototype on a flexible polyimide film, which is not compatible with the fabrication process of bulk single-crystal devices. The ATOP will play a central role in the development of next generation advanced technologies where devices require large area fabrication on flexible substrates and three-dimensional integration.


2021 ◽  
Vol 17 ◽  
pp. 100352
Author(s):  
S.-J. Wang ◽  
M. Sawatzki ◽  
H. Kleemann ◽  
I. Lashkov ◽  
D. Wolf ◽  
...  

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