scholarly journals A New Surface Tension Model for Particle Methods with Enhanced Splash Computation

Author(s):  
Abbas KHAYYER ◽  
Hitoshi GOTOH ◽  
Naoki TSURUTA
2007 ◽  
Vol 55 (3) ◽  
pp. 225-240 ◽  
Author(s):  
Shuai Zhang ◽  
Koji Morita ◽  
Kenji Fukuda ◽  
Noriyuki Shirakawa

Author(s):  
Eiji Ishii ◽  
Taisuke Sugii

Predicting the spreading behavior of droplets on a wall is important for designing micro/nano devices used for reagent dispensation in micro-electro-mechanical systems, printing processes of ink-jet printers, and condensation of droplets on a wall during spray forming in atomizers. Particle methods are useful for simulating the behavior of many droplets generated by micro/nano devices in practical computational time; the motion of each droplet is simulated using a group of particles, and no particles are assigned in the gas region if interactions between the droplets and gas are weak. Furthermore, liquid-gas interfaces obtained from the particle method remain sharp by using the Lagrangian description. However, conventional surface tension models used in the particle methods are used for predicting the static contact angle at a three-phase interface, not for predicting the dynamic contact angle. The dynamic contact angle defines the shape of a spreading droplet on a wall. We previously developed a surface tension model using inter-particle force in the particle method; the static contact angle of droplets on the wall was verified at various contact angles, and the heights of droplets agreed well with those obtained theoretically. In this study, we applied our surface tension model to the simulation of a spreading droplet on a wall. The simulated dynamic contact angles for some Weber numbers were compared with those measured by Šikalo et al, and they agreed well. Our surface tension model was useful for simulating droplet motion under static and dynamic conditions.


2008 ◽  
Vol 183 (1) ◽  
pp. 21-26 ◽  
Author(s):  
Guangzheng Zhou ◽  
Wei Ge ◽  
Jinghai Li

Author(s):  
Eiji Ishii ◽  
Taisuke Sugii

The particle method is a useful approach to simulate fluid flows within micro/nano spaces such as micro-electromechanical systems, nano-in-print processes, and head-disk interfaces of hard disk drives. Particle methods are based on continuum dynamics, and some studies have recently extended the scope of these methods to approaches within micro/nano spaces. Surface tension is a dominant force in the fluid flow within micro/nano spaces. However, surface-tension models used in the particle methods need to be improved to achieve more stable and accurate simulation. In the present study, we developed a new surface tension model for the particle method using inter-particle force to improve the stability and accuracy of simulation; the inter-particle force was given by the derivation of potential energy in space. The developed surface tension model was verified using simple benchmark tests: pressure in a round droplet and oscillation period of a square liquid-droplet. The predicted pressure in a round droplet agreed well with that given by the Young-Laplace equation, and the predicted oscillation period of a square droplet agreed well with that given by Lamb’s theory. The wall-adhesion was also verified at various contact angles; heights of droplets on the wall agreed well with those given theoretically. We found that our new surface tension model was useful for simulating fluid flow within micro/nano spaces for particle method.


1990 ◽  
Vol 112 (3) ◽  
pp. 219-222 ◽  
Author(s):  
S. M. Heinrich ◽  
N. J. Nigro ◽  
A. F. Elkouh ◽  
P. S. Lee

In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae.


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