scholarly journals Room Temperature Deformation Behavior of Zn-22 mass%Al Alloy with Nanocrystalline Structure

2002 ◽  
Vol 43 (10) ◽  
pp. 2449-2454 ◽  
Author(s):  
Tsutomu Tanaka ◽  
Koichi Makii ◽  
Atsumichi Kushibe ◽  
Kenji Higashi
Keyword(s):  
Deformation Behavior ◽  
Room Temperature ◽  
Nanocrystalline Structure ◽  
Temperature Deformation ◽  
Al Alloy

Extensive deformation behavior of an all-oxide Al2O3-TiO2 nanostructured multilayer ceramic at room temperature

2009 ◽  
Vol 24 (11) ◽  
pp. 3387-3396 ◽  
Author(s):  
Arcan F. Dericioglu ◽  
Y.F. Liu ◽  
Yutaka Kagawa
Keyword(s):  
Cross Sections ◽  
Deformation Behavior ◽  
Room Temperature ◽  
Temperature Deformation ◽  
Relative Movement ◽  
Element Simulation ◽  
Columnar Grains ◽  
Multilayer Ceramic ◽  
Extensive Deformation ◽  
Indentation Response

An all-oxide Al2O3-TiO2 ceramic multilayer composed of 10–100 nm thick alternating layers was fabricated using the reactive magnetron sputtering process. Microindentation tests were carried out on the multilayer ceramic followed by microstructural observations of the cross-sections of the indented sites to characterize the indentation response of the system. During the observations, it was noted that an extensive room temperature “deformation” occurred in the multilayer ceramic material. The material shows a thickness reduction of as much as ∼40% under a conical indenter at 300 mN of load without microcracking and dislocation-assisted deformation. The room temperature deformation mechanism is governed by the relative movement and rearrangement of the anisotropic nanoscale columnar grains along the intergranular boundaries containing elongated voids. The relative sliding along the intergranular boundaries, and the subsequent granular rotation under indentation were well captured by finite element simulation.

Hot Deformation Behavior of 2519 Al Alloy during Isothermal Compression

2007 ◽  
Vol 546-549 ◽  
pp. 749-754 ◽  
Author(s):  
Hui Zhong Li ◽  
Xin Ming Zhang ◽  
Min Gan Chen ◽  
Ying Liu ◽  
Hui Gao
Keyword(s):  
Aluminum Alloy ◽  
Flow Stress ◽  
Strain Rate ◽  
Deformation Behavior ◽  
Deformation Temperature ◽  
High Temperature Deformation ◽  
Temperature Deformation ◽  
Al Alloy ◽  
Strain Rates ◽  
Isothermal Compression

The deformation behavior of 2519 aluminum alloy was studied by isothermal compression by Gleeble-1500 simulator in the temperature range from 300 to 450°C under the strain rates of 0.01~10s-1. The results showed that the flow stress was controlled by strain rate and deformation temperature. The flow stress increased with strain rate and decreased with deformation temperature. The flow stress of 2519 aluminum alloy increased with strain and to the constant values at three strain rates of 0.01 s-1,0.1 s-1and1 s-1, indicating the dynamic recovery to occur. The flow stress decreased after a peak value with increase of strain at strain rate 10s-1 and deformation temperature higher than 350°C, showing partly dynamic recrystallization. The flow stress of 2519 aluminum alloy during high temperature deformation can be represented by Zener-Hollomon parameter.

Deformation Behavior of Leadless 60% Pb–40% Sn Solder Joints

1987 ◽  
Vol 108 ◽  
Author(s):  
Ravichandran Subrahmanyan ◽  
Donald Stone ◽  
Che-Yu Li
Keyword(s):  
Fatigue Life ◽  
Deformation Behavior ◽  
Room Temperature ◽  
Bauschinger Effect ◽  
Solder Joints ◽  
Accurate Prediction ◽  
Temperature Deformation ◽  
Stress Strain ◽  
Cyclic Displacement

ABSTRACTRoom temperature deformation data of leadless solder joints are reported. The joints were sheared under cyclic, displacement controlled loading at frequencies between 0.001 and 0.01 Hz. A microplastic model was utilized to simulate the stress-strain loops, which demonstrated a pronounced Bauschinger effect. The implications of microplasticity on fatigue life of solder joints are discussed. This phenomenon must be taken into account in an accurate prediction of solder deformation at low strain ranges.

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