Cooling Methods for High-Power Electronic Systems

2011 ◽  
Vol 29 (1) ◽  
pp. 79-86 ◽  
Author(s):  
Andrei Blinov ◽  
Dmitri Vinnikov ◽  
Tõnu Lehtla
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Cooling System ◽  
Electronic System ◽  
Electronic Systems ◽  
Power Electronic ◽  
Automotive Systems ◽  
Mass Size ◽  
And Performance ◽  
Cooling Methods

Cooling Methods for High-Power Electronic Systems Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.

Numerical Investigation of Electronic Liquid Cooling Based on the Thermomagnetic Effect

2012 ◽  
Author(s):  
Giti Karimi-Moghaddam ◽  
Richard D. Gould ◽  
Subhashish Bhattacharya
Keyword(s):  
Magnetic Field ◽  
High Power ◽  
Heat Load ◽  
Waste Heat ◽  
Cooling System ◽  
Numerical Study ◽  
Electronic Systems ◽  
Power Electronic ◽  
Flow Loop ◽  
Liquid Cooling

Liquid cooling for thermal management has been widely applied in high power electronic systems. Use of pumps may often introduce reliability and mechanical limitations such as vibration of moving parts, noise problems, leakage problems, and considerable power consumption. This paper presents a theoretical design of circulating a liquid coolant using magnetic and thermal fields which surround high power electronic systems by means of thermomagnetic effects of temperature sensitive magnetic fluids. Numerical simulation models of the heat transfer process from a magnetic liquid contained in a closed flow loop in the presence of an external magnetic field have been developed. These models include the coupling of three fundamental phenomena, i.e. magnetic, thermal, and fluid dynamic features. In this cooling device, the thermomagnetic convection is generated by a non-uniform magnetic field from a solenoid, which is placed close to the fluid loop. The device cooling load is calculated in the region near the solenoid. No energy is needed, other than the heat load (i.e. waste heat from actual electrical device), to drive the cooling system, and as such, the device can be considered completely self-powered. In effect, the heat added to the ferrofluid in the presence of a magnetic field is converted into useful flow work. In this numerical study, the effects of different factors such as input heat load, magnetic field strength and magnetic distribution (based on solenoid dimensions and the applied electrical current) along the loop, on the performance of the cooling system are analyzed and discussed. Finally, the variation of the local Nusselt number along the heated and cooled regions of the flow loop are calculated and compared with laminar entry length analytical solutions.

Thermal Topology Optimization for High Power Density Power Electronic Systems in Passively Cooled Housings

2021 ◽  
Author(s):  
Julian Weimer ◽  
Dominik Koch ◽  
Maximilian Nitzsche ◽  
Jorg Haarer ◽  
Ingmar Kallfass
Keyword(s):  
Topology Optimization ◽  
Power Density ◽  
High Power ◽  
Electronic Systems ◽  
Power Electronic ◽  
High Power Density

757 Development of a Forced-Liquid Cooling System for High Power Electronic Chips Using ECF

2005 ◽  
Vol 2005 (0) ◽  
pp. 219-220
Author(s):  
Woo-Suk SEO ◽  
Kazuhiro YOSHIDA ◽  
Shinichi YOKOTA ◽  
Kazuya EDAMURA
Keyword(s):  
High Power ◽  
Cooling System ◽  
Power Electronic ◽  
Liquid Cooling ◽  
Liquid Cooling System

Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop

2003 ◽  
Author(s):  
Laura J. Meyer ◽  
Leslie M. Phinney
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Electronic Devices ◽  
Maximum Size ◽  
Power Electronic ◽  
Power Devices ◽  
Pressure Balance ◽  
Capillary Pumped Loop ◽  
Two Phase ◽  
Bandgap Semiconductors

Wide bandgap semiconductors such as SiC and GaN are materials that are advantageous for high power electronic devices. High power devices generate large amounts of energy that must be removed, and traditional cooling methods are insufficient for maintaining the desired operating temperatures. Thus, thermal management methods for high power electronic devices need to be developed. A SiC micro-capillary pumped loop thermal management system is being evaluated to cool SiC high power devices. Mathematical models incorporating two-phase flow and capillary wicking have been developed to analyze capillary pumped loops or loop heat pipes. This investigation uses a model based on the methodology of Dickey and Peterson (1994). The model takes an energy balance on the condenser and evaporator regions, as well as a pressure balance across the meniscus. A parametric study has been performed on the micro-CPL to determine the best design for a p-i-n diode that is less than 1 cm square and which produces a heat flux at the junction of over 300 W/cm2. The micro-CPL will be limited to a maximum size of 6.5 cm2. The liquid and vapor line lengths, number of grooves, and groove dimensions are varied to determine optimal values. The results and trends of the optimization calculations are discussed.

Silicon-Based Microphotonics and Integrated Optoelectronics

MRS Bulletin ◽  
1998 ◽  
Vol 23 (4) ◽  
pp. 39-47 ◽  
Author(s):  
E.A. Fitzgerald ◽  
L.C. Kimerling
Keyword(s):  
Driving Force ◽  
Complementary Metal Oxide Semiconductor ◽  
Electronic System ◽  
Cmos Technology ◽  
Labor Cost ◽  
Oxide Semiconductor ◽  
Electronic Systems ◽  
Remarkable Feature ◽  
And Performance ◽  
The Cost

The need for integrated optical interconnects in electronic systems is derivedfrom the cost and performance of electronic systems. If we examine the cost of all interconnects, it becomes apparent that there is an exponential growth in cost per interconnect with the length of the interconnect. A remarkable feature of interconnect cost is that the exponential relation holds over all length scales—from the shortest interconnects on a chip to the longest interconnects in global telecommunications networks. Longer interconnects are drastically more expensive, and these costs are ultimately related to the labor cost associated with each interconnect. Given this economic pressure, it is not surprising that there is a driving force to condense more functions locally on the same chip, board, or system. In condensing these functions, the number of long interconnects are decreased and the overall cost of the electronic system decreases dramatically. A specific glaring example of this driving force is Si complementary-metal-oxide-semiconductor (CMOS) technology, especially the case of microprocessors. In the Si microprocessor case, the flood gates to interconnect condensation were opened and the miraculous trend of lower cost for exponentially increasing performance was revealed.

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