Thermal management of a power electronic module employing a novel multi-micro nozzle liquid-based cooling system: A numerical study

Electric vehicles (EVs) powered by lithium batteries, which are a promising type of green transportation, have attracted much attention in recent years. In this study, a thermoelectric generator (TEG) coupled with forced convection (F-C) was designed as an effective and feasible cooling system for a battery thermal management system. A comparison of natural convection cooling, F-C cooling, and TEG cooling reveals that the TEG is the best cooling system. Specifically, this system can decrease the temperature by 16.44% at the discharge rate of 3C. The coupled TEG and F-C cooling system can significantly control temperature at a relatively high discharge rate. This system not only can decrease the temperature of the battery module promptly but also can reduce the energy consumption compared with the two other TEG-based cooling systems. These results are expected to supply an effective basis of the design and optimization of battery thermal management systems to improve the reliability and safety performance of EVs.

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Isothermalization of an IGBT Power Electronic Chip

Volume 4: Electronics and Photonics ◽

10.1115/imece2010-41019 ◽

2010 ◽

Cited By ~ 1

Author(s):

Peng Wang ◽

F. Patrick McCluskey ◽

Avram Bar-Cohen

Keyword(s):

Thermal Management ◽

Hybrid Electric Vehicles ◽

Cooling System ◽

Heat Fluxes ◽

Maximum Temperature ◽

Power Electronic ◽

Liquid Cooling ◽

Thermo Electric ◽

Critical Issues ◽

System Designs

Rapid increases in the power ratings and continued miniaturization of power electronic semiconductor devices have pushed chip heat fluxes well beyond the range of conventional thermal management techniques. The heat flux of power electronic chips for hybrid electric vehicles is now at the level of 100 to 150W/cm2 and is projected to increase to 500 W/cm2 in next generation vehicles. Such heat fluxes lead to higher and less uniform IGBT chip temperature, significantly degrading the device performance and system reliability. Maintaining the maximum temperature below a specified limit, while isothermalizing the surface of the chip, have become critical issues for thermal management of power electronics. In this work, a hybrid cooling system design, which combines microchannel liquid cooling and thermoelectric solid-state cooling, is proposed for thermal management of a 10mm × 10mm IGBT chip. The microchannel heat sink is used for global cooling of the chip while the embedded thermo-electric cooler is employed for isothermalization of the chip. A detailed package level 3D thermal model is developed to explore the potential application of this concept, with an attention focused on isothermalization and temperature reduction of IGBT chip associated with variations in thermoelectric cooler sizes, thermoelectric materials, cooling system designs, and trench structures in the DBC substrate. It is found that a thin-film superlattice TEC can deliver a superior cooling performance by eliminating more than 90% of the temperature non-uniformity on 100∼200 W/cm2 IGBT chips.

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Numerical Investigation of Electronic Liquid Cooling Based on the Thermomagnetic Effect

Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D ◽

10.1115/imece2012-87764 ◽

2012 ◽

Cited By ~ 3

Author(s):

Giti Karimi-Moghaddam ◽

Richard D. Gould ◽

Subhashish Bhattacharya

Keyword(s):

Magnetic Field ◽

High Power ◽

Heat Load ◽

Waste Heat ◽

Cooling System ◽

Numerical Study ◽

Electronic Systems ◽

Power Electronic ◽

Flow Loop ◽

Liquid Cooling

Liquid cooling for thermal management has been widely applied in high power electronic systems. Use of pumps may often introduce reliability and mechanical limitations such as vibration of moving parts, noise problems, leakage problems, and considerable power consumption. This paper presents a theoretical design of circulating a liquid coolant using magnetic and thermal fields which surround high power electronic systems by means of thermomagnetic effects of temperature sensitive magnetic fluids. Numerical simulation models of the heat transfer process from a magnetic liquid contained in a closed flow loop in the presence of an external magnetic field have been developed. These models include the coupling of three fundamental phenomena, i.e. magnetic, thermal, and fluid dynamic features. In this cooling device, the thermomagnetic convection is generated by a non-uniform magnetic field from a solenoid, which is placed close to the fluid loop. The device cooling load is calculated in the region near the solenoid. No energy is needed, other than the heat load (i.e. waste heat from actual electrical device), to drive the cooling system, and as such, the device can be considered completely self-powered. In effect, the heat added to the ferrofluid in the presence of a magnetic field is converted into useful flow work. In this numerical study, the effects of different factors such as input heat load, magnetic field strength and magnetic distribution (based on solenoid dimensions and the applied electrical current) along the loop, on the performance of the cooling system are analyzed and discussed. Finally, the variation of the local Nusselt number along the heated and cooled regions of the flow loop are calculated and compared with laminar entry length analytical solutions.

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Cooling Methods for High-Power Electronic Systems

Scientific Journal of Riga Technical University Power and Electrical Engineering ◽

10.2478/v10144-011-0014-x ◽

2011 ◽

Vol 29 (1) ◽

pp. 79-86 ◽

Cited By ~ 4

Author(s):

Andrei Blinov ◽

Dmitri Vinnikov ◽

Tõnu Lehtla

Keyword(s):

Thermal Management ◽

High Power ◽

Cooling System ◽

Electronic System ◽

Electronic Systems ◽

Power Electronic ◽

Automotive Systems ◽

Mass Size ◽

And Performance ◽

Cooling Methods

Cooling Methods for High-Power Electronic Systems Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.

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Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems ◽

10.1115/ipack2018-8210 ◽

2018 ◽

Author(s):

Ruikang Wu ◽

Wei Lan ◽

Xingjian Yu ◽

Weicheng Shu ◽

Meng Wang ◽

...

Keyword(s):

Fluid Flow ◽

Pressure Distribution ◽

Journal Bearing ◽

Cooling System ◽

Numerical Study ◽

Load Capacity ◽

Liquid Cooling ◽

System A ◽

Active Liquid ◽

Liquid Cooling System

Active liquid cooling is one of the most efficient and promising strategy for extreme thermal issues. As is the power source of the active liquid cooling system, a reliable and powerful micropump is urgently needed. In this study, we numerically studied the fluid flow of a hydrodynamic levitated micropump, considering the fluid flow in the motor. We found that the load capacity of the journal bearing is not influenced by the pump fluid flow. However, the pressure distribution of the journal bearing results in the dissymmetric pressure distribution in the spiral groove bearing, leading to worse stability of the axial levitation performance. The axial suspension force is at least 1.0N with the liquid film thickness of 15μm and is sufficient for the rotor with weight of 30g to be stably levitated in the fluid. Owing to the pressure difference inside the pump, the balance point of the rotor should be lower than the theoretical design when the micropump is operating.

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NUMERICAL STUDY OF A SOLAR LITHIUM BROMIDE-WATER ABSORPTION COOLING SYSTEM

10.26678/abcm.encit2018.cit18-0061 ◽

2018 ◽

Author(s):

Raquel Miguez de Carvalho ◽

Kamal Ismail

Keyword(s):

Water Absorption ◽

Cooling System ◽

Numerical Study ◽

Lithium Bromide ◽

Absorption Cooling ◽

Absorption Cooling System

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Numerical Study of a Cooling System Using Phase Change of a Refrigerant in a Thermosyphon

Energies ◽

10.3390/en14123634 ◽

2021 ◽

Vol 14 (12) ◽

pp. 3634

Author(s):

Grzegorz Czerwiński ◽

Jerzy Wołoszyn

Keyword(s):

Mass Transfer ◽

Phase Change ◽

Heat Dissipation ◽

Cooling System ◽

Numerical Study ◽

Relaxation Parameter ◽

Phase Changes ◽

Transfer Time ◽

Two Phase ◽

Time Relaxation

With the increasing trend toward the miniaturization of electronic devices, the issue of heat dissipation becomes essential. The use of phase changes in a two-phase closed thermosyphon (TPCT) enables a significant reduction in the heat generated even at high temperatures. In this paper, we propose a modification of the evaporation–condensation model implemented in ANSYS Fluent. The modification was to manipulate the value of the mass transfer time relaxation parameter for evaporation and condensation. The developed model in the form of a UDF script allowed the introduction of additional source equations, and the obtained solution is compared with the results available in the literature. The variable value of the mass transfer time relaxation parameter during condensation rc depending on the density of the liquid and vapour phase was taken into account in the calculations. However, compared to previous numerical studies, more accurate modelling of the phase change phenomenon of the medium in the thermosyphon was possible by adopting a mass transfer time relaxation parameter during evaporation re = 1. The assumption of ten-fold higher values resulted in overestimated temperature values in all sections of the thermosyphon. Hence, the coefficient re should be selected individually depending on the case under study. A too large value may cause difficulties in obtaining the convergence of solutions, which, in the case of numerical grids with many elements (especially three-dimensional), significantly increases the computation time.

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