scholarly journals Ductile-Brittle Transition during Diamond Turning of Single-Crystal Silicon.

1999 ◽  
Vol 65 (10) ◽  
pp. 1512-1516 ◽  
Author(s):  
Takayuki SHIBATA ◽  
Akihiro FUJII ◽  
Eiji MAKINO
Keyword(s):  
Single Crystal ◽  
Single Crystal Silicon ◽  
Diamond Turning ◽  
Crystal Silicon ◽  
Brittle Transition

Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon

2011 ◽  
Vol 496 ◽  
pp. 223-228 ◽  
Author(s):  
Saurav Goel ◽  
Xi Chun Luo ◽  
R.L. Reuben ◽  
Waleed Bin Rashid ◽  
Ji Ning Sun
Keyword(s):  
Single Crystal ◽  
Cutting Forces ◽  
Diamond Tool ◽  
Single Crystal Silicon ◽  
Potential Energy Function ◽  
Diamond Turning ◽  
Limiting Factor ◽  
Crystal Silicon ◽  
Realistic Potential ◽  
Ductile Regime Machining

Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.

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