Flow visualization and numerical simulation of flow in a cubic chamber with offset inlet and outlet

1991 ◽  
Author(s):  
LUKE CHEN ◽  
RAMIRO BRAVO ◽  
CHING-JEN CHEN
Materials ◽  
2019 ◽  
Vol 12 (7) ◽  
pp. 1099 ◽  
Author(s):  
Hanxue Cao ◽  
Chao Shen ◽  
Chengcheng Wang ◽  
Hui Xu ◽  
Juanjuan Zhu

Although numerical simulation accuracy makes progress rapidly, it is in an insufficient phase because of complicated phenomena of the filling process and difficulty of experimental verification in high pressure die casting (HPDC), especially in thin-wall complex die-castings. Therefore, in this paper, a flow visualization experiment is conducted, and the porosity at different locations is predicted under three different fast shot velocities. The differences in flow pattern between the actual filling process and the numerical simulation are compared. It shows that the flow visualization experiment can directly observe the actual and real-time filling process and could be an effective experimental verification method for the accuracy of the flow simulation model in HPDC. Moreover, significant differences start to appear in the flow pattern between the actual experiment and the Anycasting solution after the fragment or atomization formation. Finally, the fast shot velocity would determine the position at which the back flow meets the incoming flow. The junction of two streams of fluid would create more porosity than the other location. There is a transition in flow patterns due to drag crisis under high fast shot velocity around two staggered cylinders, which resulted in the porosity relationship also changing from R1 < R3 < R2 (0.88 m/s) to R1 < R2 < R3 (1.59 and 2.34 m/s).


1989 ◽  
Vol 32 (3) ◽  
pp. 19-24
Author(s):  
Frederick Kern

Improved room and equipment aerodynamics can have a significant impact on the ability to obtain acceptable yields on high density semiconductor products.1 Goals for the equipment engineer/vendor are presented here, a set of design guidelines is established, and a design and test regimen formulated to achieve aerodynamically acceptable equipment designs is proposed.


Energy ◽  
2016 ◽  
Vol 104 ◽  
pp. 1-15 ◽  
Author(s):  
Seyed Ali Kazemi ◽  
Mahdi Nili-Ahmadabadi ◽  
Ahmad Sedaghat ◽  
Mohsen Saghafian

1986 ◽  
Vol 6 (22) ◽  
pp. 219-224
Author(s):  
Tadatomo KOJIMA ◽  
Yoshihiro MATSUOKA ◽  
Yasuhiro OUWA

2012 ◽  
Vol 6 (4) ◽  
pp. 418-425 ◽  
Author(s):  
Sayako Sakama ◽  
◽  
Yutaka Tanaka ◽  
Ryushi Suzuki ◽  

Air bubbles in working oil affect the stiffness and efficiency of hydraulic systems; thus it is important for technical issues that air bubbles be actively eliminated from the hydraulic oil. A bubble eliminator is a device that uses a swirl flow to remove air bubbles. The shape of the device affects bubble elimination performance, so the selection of shape is the most important parameter in increasing the performance of the device. The purpose of this study is to design a bubble eliminator with an optimal shape. This paper discusses the validity of numerical simulation by comparing, using various diameters of the vent port, the numerical results with the results of the experimental flow visualization. Moreover, we focus on the length of the inlet tube and tapered tube of the bubble eliminator and establish a method of selecting them.


2018 ◽  
Vol 140 (8) ◽  
Author(s):  
Chia-Yuan Chen ◽  
Bivas Panigrahi ◽  
Kok-Shen Chong ◽  
Wei-Hsien Li ◽  
Yi-Li Liu ◽  
...  

In the current semiconductor industrial scenario, wafers are rinsed in an overflow rinsing tank while being mounted on several lifters prior to most of its manufacturing processes. However, a major drawback of this overflow rinsing methodology is that some of the processing fluid stagnates due to the generated vortices in the regions between the side and middle lifters which entrap some of the flushed particles that further adhere and deteriorate the surface of the wafers. In this work, the hydrodynamics of the flow field inside the wafer rinsing tank with this original lifter orientation setup was studied and compared through numerical simulation and flow visualization using particle image velocimetry (PIV) method, and a strong agreement was found between them in terms of velocity calculation. A new lifter orientation setup was initiated and it was evidenced by the numerical simulation that with this new setup, the generated vortices which are situated opposite to the lifters tilting direction can be displaced significantly in terms of magnitude and distribution. This work presents a new wafer cleaning concept which shows its great potentials in improvement and implementation to the current in-line wafer batch fabrication process without modifying the original design of the rinsing tank.


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