scholarly journals Science and Technology Application in the Field of Rolling Paper Art

Author(s):  
Jingchao Liu ◽  
Xiaohui Li ◽  
Hongzhuan Cai ◽  
Yanyan Cao
2021 ◽  
Vol 7 (1) ◽  
pp. 36-40
Author(s):  
Indah Setiawati ◽  
Rosi Widarawati ◽  
Pepita Haryanti ◽  
Okti Herliana

The science and technology application activities are planned to be carried out with the partner of the women farmer group located in Kediri Village, Karanglewas District. The problems faced by partners are not having adequate knowledge about natural pest management and the correct use of organic fertilizers; do not have skills in making and using vegetable pesticides, liquid organic fertilizers, and proper organic vegetable cultivation techniques. The purpose of applying science and technology is to provide knowledge about the functions and ways of using vegetable pesticides and liquid organic fertilizers, improving skills in making and using vegetable pesticides, POC, technical complete package of organic vegetable cultivation. Methods for achieving the goal are socialization and learning by doing, which are complemented by guiding and piloting techniques. The output of the service activities is in the form of articles in dedication journals, and articles on appropriate technology (TTG).


Author(s):  
Tran Minh Tam ◽  
Tran Van Hong

Scientific and technological information products and services are one of the important factors that create the scientific and technological information potential of each country. In the context of the Fourth Industrial Revolution having a strong impact on all aspects of socio-economic life, the policy of applying information technology to the development of information science and technology products and services needs improving to promote the provision of scientific and technological information products and services to organizations, individuals and businesses. On the basis of systematization and assessment of current regulations on information technology application policies in the development of information science and technology products and services, the study proposes some orientations to improve the current policy.


2015 ◽  
Vol 2 ◽  
pp. 17
Author(s):  
Hua Qiao

<p>The digital surveying and mapping technology is widely used in engineering survey. The digital surveying and mapping technology keeps updating and improving along with the progress of science and technology and creates more contributions in engineering survey. The survey staffs shall keep studying and expanding their knowledge to improve their professional capability to serve our country better in surveying area. The author studied the application of digital surveying and mapping technology in highway measurement along with years of experience. This article is an important source of reference.</p>


1962 ◽  
Vol 14 ◽  
pp. 441-444 ◽  
Author(s):  
J. E. Geake ◽  
H. Lipson ◽  
M. D. Lumb

Work has recently begun in the Physics Department of the Manchester College of Science and Technology on an attempt to simulate lunar luminescence in the laboratory. This programme is running parallel with that of our colleagues in the Manchester University Astronomy Department, who are making observations of the luminescent spectrum of the Moon itself. Our instruments are as yet only partly completed, but we will describe briefly what they are to consist of, in the hope that we may benefit from the comments of others in the same field, and arrange to co-ordinate our work with theirs.


Author(s):  
T. C. Tisone ◽  
S. Lau

In a study of the properties of a Ta-Au metallization system for thin film technology application, the interdiffusion between Ta(bcc)-Au, βTa-Au and Ta2M-Au films was studied. Considered here is a discussion of the use of the transmission electron microscope(TEM) in the identification of phases formed and characterization of the film microstructures before and after annealing.The films were deposited by sputtering onto silicon wafers with 5000 Å of thermally grown oxide. The film thicknesses were 2000 Å of Ta and 2000 Å of Au. Samples for TEM observation were prepared by ultrasonically cutting 3mm disks from the wafers. The disks were first chemically etched from the silicon side using a HNO3 :HF(19:5) solution followed by ion milling to perforation of the Au side.


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