scholarly journals Transformations in the Grain Boundary Ensemble of M1 Copper Subjected to Equal-Channel Angular Pressing during Recrystallization Annealing

2018 ◽  
Vol 82 (7) ◽  
pp. 773-777
Author(s):  
O. B. Perevalova ◽  
E. V. Konovalova ◽  
Yu. R. Kolobov ◽  
A. I. Korshunov
Keyword(s):  
Grain Boundary ◽  
Equal Channel Angular Pressing ◽  
Recrystallization Annealing ◽  
Angular Pressing

Grain Boundary Engineering of ECAPed OFHC Copper

2016 ◽  
Vol 879 ◽  
pp. 2192-2197
Author(s):  
Wen Feng ◽  
Jun Hui Zhang ◽  
Sen Yang
Keyword(s):  
Grain Boundary ◽  
Equal Channel Angular Pressing ◽  
Coincidence Site Lattice ◽  
Electron Back Scatter Diffraction ◽  
Ofhc Copper ◽  
Grain Boundary Engineering ◽  
Site Lattice ◽  
Angular Pressing ◽  
Grain Boundary Character ◽  
High Fraction

Grain boundary character distributions (GBCD) of OFHC copper equal-channel angular pressing (ECAP) deformed and then annealed were analyzed by electron back scatter diffraction (EBSD). The experimental results showed that a combination of ECAP deformation and annealing treatments could significantly increase the fraction of low-Σ coincidence site lattice (CSL) boundaries (Σ≤29) and effectively interrupt the connectivity of random boundaries network in OFHC copper. An increase of low-Σ CSL boundaries from 45.27 to 71.06% was observed in as-received material after one pass ECAP strain followed by annealing at 350 °C for 48 h. The connectivity of random boundaries network was interrupted by high fraction of low-Σ CSL boundaries.

Deformation Mechanisms of Single Crystals and Bicrystals Subjected to Equal-Channel Angular Pressing - Review

2009 ◽  
Vol 633-634 ◽  
pp. 511-525
Author(s):  
Wei Zhong Han ◽  
Shou Xin Li ◽  
Shi Ding Wu ◽  
Zhe Feng Zhang
Keyword(s):  
Grain Boundary ◽  
Single Crystals ◽  
Shear Deformation ◽  
Equal Channel Angular Pressing ◽  
Microstructural Evolution ◽  
Crystallographic Orientation ◽  
World Wide ◽  
Experimental Results ◽  
Deformation Mechanisms ◽  
Angular Pressing

The deformation mechanisms of various kinds of single crystals and bicrystals during the process of equal channel angular pressing (ECAP) have been paid more attention world wide. This paper reviews the recent progresses in the understanding of the deformation mechanisms of single crystals and bicrystals subjected to one-pass ECAP, and discusses the effect of initial crystallographic orientation and grain boundary on the microstructural evolution of these crystals. Based on those experimental results and analysis, it is suggested that in addition to the shear deformation along the intersection plane (IP) of ECAP die, the shear along the normal of IP also plays an important role in affecting the microstructural evolution and deformation mechanisms of these single crystals and bicrystals.

Grain Boundary Radiotracer Diffusion of Ni in Ultra-Fine Grained Cu and Cu - 1wt.% Pb Alloy Produced by Equal Channel Angular Pressing

2008 ◽  
Vol 584-586 ◽  
pp. 380-386 ◽  
Author(s):  
Jens Ribbe ◽  
Guido Schmitz ◽  
Y. Amouyal ◽  
Yuri Estrin ◽  
Sergiy V. Divinski
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Equal Channel Angular Pressing ◽  
Boundary Diffusion ◽  
Ion Beam ◽  
Short Circuit ◽  
Grain Boundary Diffusion ◽  
Coarse Grained ◽  
Angular Pressing ◽  
Diffusion Paths

The radiotracer technique was applied for measuring grain boundary diffusion of Ni in ultrafine grained (UFG) copper materials with different nominal purities and in a Cu—1wt.%Pb alloy. The UFG specimens were prepared by equal channel angular pressing at room temperature. The stability of the microstructure was studied by focused ion beam imaging. Grain boundary diffusion of the 63Ni radioisotope was investigated in the temperature interval from 293 to 490K under the formal Harrison type C kinetic conditions. Two distinct short-circuit diffusion paths were observed. The first (relatively slow) path in the UFG materials corresponds unambiguously to relaxed high-angle grain boundaries with diffusivities which are quite similar to those in the respective coarse-grained reference materials. The second path is characterized by significantly higher diffusivities. The experimental data are discussed to elucidate the contribution of nonequilibrium grain boundaries in the deformed materials. Alternative contributions of other shortcircuit diffusion paths cannot be ruled out, particularly for the Cu-Pd alloy.

scholarly journals Misorientation Change of the Grain Boundary in Pure Copper Bicrystals Subjected to One-Pass Equal-Channel Angular Pressing

2012 ◽  
Vol 53 (11) ◽  
pp. 1858-1862 ◽  
Author(s):  
Yohei Wadamori ◽  
Kentoku Hirayama ◽  
Hiroshi Fujiwara ◽  
Toshiyuki Uenoya ◽  
Hiroyuki Miyamoto
Keyword(s):  
Grain Boundary ◽  
Equal Channel Angular Pressing ◽  
Pure Copper ◽  
Angular Pressing
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