Reliabilities and Failure Analysis of Printed Circuit Boards Interconnect Stress Test

2018 ◽  
Author(s):  
Ying Yang
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Circuit Boards ◽  
Printed Circuit

High Temperature Laminate Characterization

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000235-000245
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Model Development ◽  
Peel Strength ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Mean Lifetime ◽  
The Mean

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization and modeling high temperature laminates for application at 200 to 250°C was conducted to better quantify the mean lifetime using accelerated testing of key functional parameters. Life testing and model development was applied for via cyclic life, peel strength, and weight loss. Four high temperature laminates consisting of 2 types were evaluated. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples.

Mechanical Test of FPCB and Failure Analysis by Simulation

2009 ◽  
Author(s):  
Jian Zhong ◽  
Ping Yang ◽  
Jian-ping Li ◽  
Hai-bo Sun ◽  
Quayle Chen ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Boards ◽  
Simulation Analysis ◽  
Mechanical Test ◽  
Mechanical Tests ◽  
Stress Distributions ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Depth Analysis ◽  
Flexible Printed Circuit

The paper mainly presented mechanical test and failure analysis methods to reliability study of a new FPCB (Flexible Printed Circuit Boards). Mechanical tests include flexural test, tensile test and flexural fatigue and ductility test. As to simulation analysis, the stress distributions of FPCB under bending and tensile conditions were gained by simulations. Through in-depth analysis of the testing results, the mechanical reliability of FPCB was known detailed. The research provides an approach to improve FPCB performance.

Failure analysis of printed circuit boards in the main telephone system of marine product factory

2016 ◽  
Vol 62 ◽  
pp. 300-305 ◽  
Author(s):  
Masamitsu Watanabe ◽  
Masaaki Takaya ◽  
Morihiko Matsumoto ◽  
Jun'ichi Sakai
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Telephone System ◽  
Marine Product

Reliability of High Temperature Laminates

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000100-000110 ◽  
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Peel Strength ◽  
Circuit Boards ◽  
Cyclic Life ◽  
Printed Circuit ◽  
Surface Insulation Resistance

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization of high temperature laminates for application at 200 to 250°C was conducted to better quantify their lifetime using accelerated testing of key functional parameters. Eight high temperature laminates consisting of 3 material types was evaluated. Life testing was applied for via cyclic life, weight loss, peel strength, and surface insulation resistance. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Weight loss was measured at intervals during the life of the tests. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples. The non-polyimide laminates exhibited the longer life times than polyimide laminates in most tests except peel strength. Peel strength is the life limiting parameter for the laminates. Parylene HT was found to improve stability in peel strength and weight loss of one PTFE laminate tested.

System Level FA on Transmission Line Issues

2010 ◽  
Author(s):  
Nicholas Konkol
Keyword(s):  
Failure Analysis ◽  
Transmission Line ◽  
Transmission Lines ◽  
Printed Circuit Boards ◽  
System Level ◽  
Circuit Boards ◽  
Printed Circuit

Abstract One issue that faces failure analysis at the system level is impedance mismatched transmission lines resulting from developers pushing the edge of trace layout recommendations. When transmission lines on printed circuit boards are routed in such a way as to allow for impedance mismatches, the effects can be unwanted on the signal that the line carries. Techniques can be used for discovering if capacitance, resistance, or split planes are creating the impedance mismatches that are resulting in the system level failure seen by the customer.

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