Isolating Electrically Open Laminate Defects Using Space Domain Reflectometry with a Superconducting Quantum Interference Device

Author(s):  
Kevin A. Distelhurst

Abstract An electrically open defect on a laminate may not always be found timely or successfully due to the lack of fault isolation techniques for this type of defect. This is partly due to needing high frequency techniques to isolate the location of the open. Magnetic field imaging (MFI) using a Superconducting Quantum Interference Device (SQUID) is a technique that maps, in this case, an RF signal through a trace, up until the open defect boundary. Several obstacles are introduced when using an RF signal, one of which is the shielding of the signal from the external world. Despite this obstacle, analysis of an open in an arbitrary location along a laminate under a copper plane is proven successful using this technique.

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.


2002 ◽  
Vol 11 (11) ◽  
pp. 1135-1139 ◽  
Author(s):  
Ding Hong-Sheng ◽  
Zhang Feng-Hui ◽  
Yan Xiao-Ming ◽  
Han Shi-Ji ◽  
Dong Shi-Ying ◽  
...  

2001 ◽  
Vol 78 (3) ◽  
pp. 371-373 ◽  
Author(s):  
Jongsoo Yoon ◽  
John Clarke ◽  
J. M. Gildemeister ◽  
Adrian T. Lee ◽  
M. J. Myers ◽  
...  

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