Исследование остаточных сварочных напряжений при подводной мокрой сварке низколегированной стали с применением магнитоанизотропного и рентгенодифрактометрического метода

2021 ◽  
pp. 37-50
Author(s):  
В.Е. Никулин ◽  
С.Г. Паршин ◽  
А.М. Левченко

The present study possibility of assessing residual welding stresses using magnetoanisotropic and X-ray diffractometric methods. Using the method of magnetic anisotropy approve of inhomogeneity of residual stresses in specimens with surfacing made by flux-cored wire and covered electrode in air and underwater has been revealed. The use of two nondestructive testing methods made it possible to determine and compare the values of residual welding stresses.

Metallurgist ◽  
2021 ◽  
Vol 64 (11-12) ◽  
pp. 1234-1238
Author(s):  
P. V. Shilyaev ◽  
V. L. Kornilov ◽  
L. S. Ivanova ◽  
A. A. Demidova ◽  
P. A. Stekanov ◽  
...  

Sensors ◽  
2021 ◽  
Vol 21 (18) ◽  
pp. 6175
Author(s):  
Ramesh Kumpati ◽  
Wojciech Skarka ◽  
Sunith Kumar Ontipuli

Material failure may occur in a variety of situations dependent on stress conditions, temperature, and internal or external load conditions. Many of the latest engineered materials combine several material types i.e., metals, carbon, glass, resins, adhesives, heterogeneous and nanomaterials (organic/inorganic) to produce multilayered, multifaceted structures that may fail in ductile, brittle, or both cases. Mechanical testing is a standard and basic component of any design and fabricating process. Mechanical testing also plays a vital role in maintaining cost-effectiveness in innovative advancement and predominance. Destructive tests include tensile testing, chemical analysis, hardness testing, fatigue testing, creep testing, shear testing, impact testing, stress rapture testing, fastener testing, residual stress measurement, and XRD. These tests can damage the molecular arrangement and even the microstructure of engineered materials. Nondestructive testing methods evaluate component/material/object quality without damaging the sample integrity. This review outlines advanced nondestructive techniques and explains predominantly used nondestructive techniques with respect to their applications, limitations, and advantages. The literature was further analyzed regarding experimental developments, data acquisition systems, and technologically upgraded accessory components. Additionally, the various combinations of methods applied for several types of material defects are reported. The ultimate goal of this review paper is to explain advanced nondestructive testing (NDT) techniques/tests, which are comprised of notable research work reporting evolved affordable systems with fast, precise, and repeatable systems with high accuracy for both experimental and data acquisition techniques. Furthermore, these advanced NDT approaches were assessed for their potential implementation at the industrial level for faster, more accurate, and secure operations.


2020 ◽  
Vol 10 (23) ◽  
pp. 8516
Author(s):  
Maximilian Schmid ◽  
Sri Krishna Bhogaraju ◽  
E Liu ◽  
Gordon Elger

Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to malfunctions with costly or even life-threatening consequences. To avoid or at least reduce failures, nondestructive testing (NDT) methods are common within development and production of power and opto-electronics. Currently, the dominating NDT methods are X-ray, scanning acoustic microscopy (SAM), and transient thermal analysis (TTA). However, they have different strengths and weaknesses with respect to materials and mechanical designs. This paper compares these NDT methods for different interconnect technologies, i.e., reflow soldering, adhesive, and sintered interconnection. While X-ray provided adequate results for soldered interfaces, inspection of adhesives and sintered interconnects was not possible. With SAM, evaluation of adhesives and sintered interconnects was also feasible, but quality depended strongly on the sample under test. TTA enabled sufficiently detailed results for all the interconnect applications. Automated TTA equipment, as the in-house developed tester used within this investigation, enabled measurement times compatible with SAM and X-ray. In the investigations, all methods revealed their pros and cons, and their selection has to depend on the sample under tests and the required analysis depth and data details. In the paper, guidelines are formulated for an appropriate decision on the NDT method depending on sample and requirements.


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