Simulation Research on the Heat Dissipation Performance of a High Power LED Radiator

2012 ◽  
Vol 224 ◽  
pp. 389-394
Author(s):  
Shu Zhen Jiang ◽  
Zhong Ning Guo ◽  
Yu Deng
Keyword(s):  
Thermal Analysis ◽  
Life Span ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Environment Friendly ◽  
Simulation Research ◽  
Light Emitting ◽  
High Power Led ◽  
Long Life

Applied in illumination area, high power LED (Light Emitting Diode) has a series of advantages with energy saving, environment-friendly, long life span, etc. However, the heat dissipation of the LED is a bottleneck in its development, and has become a key point which must be studied and solved urgently. In this paper, a typical LED lamp is modeled and thermal analysis has been performed using the software of Ansys.

Thermal Management for High Power Light-Emitting Diode Street Lamp

2010 ◽  
Author(s):  
M. Ying ◽  
S. M. L. Nai ◽  
P. Shi ◽  
J. Wei ◽  
C. K. Cheng ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
System Level ◽  
Light Emitting ◽  
High Power Led ◽  
Street Lamp ◽  
Lamp System

Light-emitting diode (LED) street lamp has gained its acceptance rapidly in the lighting system as one of choices for low power consumption, high reliability, dimmability, high operation hours, and good color rendering applications. However, as the LED chip temperature strongly affects the optical extraction and the reliability of the LED lamps, LED street lamp performance is heavily relied on a successful thermal management, especially when applications require LED street lamp to operate at high power and hash environment to obtain the desired brightness. As such, a well-designed thermal management, which can lower the LED chip operation temperature, becomes one of the necessities when developing LED street lamp system. The current study developed an effective heat dissipation method for the high power LED street lamp with the consideration of design for manufacturability. Different manufacturable structure designs were proposed for the high power street lamp. The thermal contact conductance between aluminum interfaces was measured in order to provide the system assembly guidelines. The module level thermal performance was also investigated with thermocouples. In addition, finite element (FE) models were established for the temperature simulation of both the module and lamp system. The coefficient of natural convection of the heat sink surface was determined by the correlation of the measurement and simulation results. The system level FE model was employed to optimize and verify the heat dissipation concepts numerically. An optimized structure design and prototype has shown that the high power LED street lamp system can meet the thermal performance requirements.

The Design of High Power LED Headlamp

2013 ◽  
Vol 423-426 ◽  
pp. 2098-2103
Author(s):  
Wen Lin Chen ◽  
Zhen An ◽  
Chao Qun Xiang ◽  
Chen Yang Liu ◽  
Li Na Hao
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Current Drive ◽  
Constant Current ◽  
Light Emitting ◽  
High Power Led ◽  
Drive Circuit ◽  
Led Headlamp ◽  
The Stability

With the continuous development of LED(Light-Emitting Diode) manufacturing technology, the high power white LED is gradually applied in the field of all kinds of lighting .But with working time increasing of LED chips, their junctions temperature continue increasing, which lead to decrease light-emitting efficiency and reliability of LED chip, and even be failure. According to the serious heating of LED chip, this paper has been designed a fin-type aluminum radiator panels using Pro/E software. A LED constant current drive circuit is designed by using LTC3783 chip. With the ANSYS software, thermal analysis was carried out on the fin-type aluminum radiator panels, and eventually the mode of high power LED headlamps is determined. The stability of the LED constant current drive circuit is verified through experiments. The LED headlamps of 90W worked for ten hours, and the results of the experiments showed that the LED chip junctions temperature measured are less than 75°Cso we can solve heat dissipation of high power LED headlamps effectively.

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

2010 ◽  
Vol 139-141 ◽  
pp. 1433-1437
Author(s):  
Kai Lin Pan ◽  
Jiao Pin Wang ◽  
Jing Liu ◽  
Guo Tao Ren
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Light Emitting ◽  
Die Attach ◽  
Dissipation Model ◽  
Key Issues

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

Heat Transfer Enhancement of the Liquid-Cooled LED Illumination Module

2013 ◽  
Vol 284-287 ◽  
pp. 768-772 ◽  
Author(s):  
Rong Yuan Jou
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Sources ◽  
The Finite Element Method ◽  
Liquid Cooling ◽  
Light Emitting ◽  
A Tec ◽  
Heat Sink Design ◽  
Temperature And Flow Fields

High-power light emitting diode (LED) modules offer several advantages over conventional light sources, but require effective thermal management for optimal performance, such as liquid cooling or thermoelectric cooling (TEC). This study compared the thermal performance of high-power LEDs with liquid cooling and TEC using both the finite element method and experiments. We considered a mutichip module in which the LEDs are immersed in one of three different cooling fluids in a metal enclosure with passive cooling or a TEC module. In the experiments, temperatures were measured by thermocouples. The temperature and flow fields of the liquid-cooled package inside the enclosure were analyzed in detail using a numerical model, and the results were validated against the experimental measurements. In this paper, we discuss the major design considerations when using liquid cooling and TEC. Our results show that for the illumination module considered in this study, appropriate heat sink design is crucial to optimizing performance with TEC, which can enhance the heat dissipation for small and compact LED modules.

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