scholarly journals Effect of Post-Weld Heat Treatment on the Solid-State Diffusion Bonding of 6061 Aluminum Alloy

2021 ◽  
Vol 11 (20) ◽  
pp. 9660
Author(s):  
Chun-Hao Chen ◽  
Yu-Kai Sun ◽  
Yu-Chang Lai ◽  
Shih-Ying Chang ◽  
Tung-Han Chuang

The precipitation-hardenable aluminum alloy 6061 (AA 6061) is favored for aerospace components and automotive parts. However, the tenacious oxide layer on the surface greatly limits the quality and applicability of joining AA 6061. In this study, the joining method of solid-state diffusion bonding was implemented for AA 6061 plates, and the effects of post-weld heat treatment (PWHT) on the joint interface were investigated. The bonding temperatures were within the range of 500–530 °C, and the time periods varied from 30 to 240 min under a static pressure of 5 MPa in a vacuum. The diffusion bonded specimens were subjected to T4- and T6-PWHT to improve the bonding quality. The interfacial microstructure of the joints was analyzed by scanning electron microscopy, and the mechanical properties were evaluated with shear tests. The experimental results showed that the shear strength of the diffusion bonded joint could reach around 71.2 MPa, which was highly dependent on bonding temperature and holding time, and T6-PWHT further enhanced it to over 100 MPa. The effects of PWHT on the diffusion bonded AA 6061 joint were investigated, and the fractography on the sheared surfaces indicated that PWHT-T6 played an important role in enhancing joint strength, which was consistent with the measured shear strength. The sequential PWHT for AA 6061 after diffusion bonding was proven to be feasible for bonding of AA 6061 parts, and the joint strength was sufficient for industrial needs.

1993 ◽  
Vol 323 ◽  
Author(s):  
Alan J. Mockler ◽  
Peter J. Goodhew ◽  
Elizabeth A. Logan

AbstractThe microstructure of 95Pb-5Sn flip-chip solder bonds deposited on Cr/Cu/Au metallisation pads has been studied using both light and electron analysis techniques. The presence of Sn-Cu- Au ternary intermetallic phases was detected within the Pb-rich matrix at significant distances from the originally deposited interface. The distribution of the phases present after the solder has undergone a reflow heat treatment can be interpreted using recent equilibrium ternary diagram data. An investigation was also made into the effects of various non-reflow heat treatments at carefully chosen temperatures, to qualitatively evaluate the extent of solid state diffusion and the resultant phase distribution.


2018 ◽  
Vol 15 (4) ◽  
pp. 045806 ◽  
Author(s):  
S S Balabanov ◽  
K N Firsov ◽  
E M Gavrishchuk ◽  
V B Ikonnikov ◽  
S Yu Kazantsev ◽  
...  

2019 ◽  
Vol 16 (5) ◽  
pp. 055004 ◽  
Author(s):  
S S Balabanov ◽  
K N Firsov ◽  
E M Gavrishchuk ◽  
V B Ikonnikov ◽  
I G Kononov ◽  
...  

Author(s):  
S.S. Balabanov ◽  
K.N. Firsov ◽  
E.M. Gavrishchuk ◽  
V.B. Ikonnikov ◽  
S.Yu. Kazantsev ◽  
...  

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