scholarly journals Copper Oxide Decorated Zinc Oxide Nanostructures for the Production of a Non-Enzymatic Glucose Sensor

Coatings ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 936
Author(s):  
Chung-En Cheng ◽  
Sripansuang Tangsuwanjinda ◽  
Hsin-Ming Cheng ◽  
Po-Han Lee

The glucose concentration in human blood can have a worrisome impact on human health, so the distribution of blood glucose contaminants in the human body is an important indicator that can be used to monitor diabetes. Diabetes affects many parts of the human body, such as neurological impairment, erectile dysfunction, and hardening of the arteries resulting in organ loss. In this study, cyclic voltammetry (CV) was used to process the electrical properties of a solution by preparing electrodes with CuO nanoparticles modified ZnO tetrapod nanostructures deposited on fluorine-doped tin oxide glass (CuO/ZnO/FTO). The measurements were processed in glucose solutions of different concentrations purposing for developing the sensitivity of the sensor. Different immersion times in the precursor copper sulfate solution were also used for preparing the electrode and carried out for electrochemical studies to adjust the electrode capability. The modified electrode, which was immersed in copper sulfate for 30 s, was efficient in detecting glucose molecules in different concentrations at the potential of +0.6 V. The rising slope is strongly and positively correlated with the concentration of glucose. One of the significant results is the indication that glucose concentration is linearly proportional to the current value of CV. After the measurement test with the addition of interference, the sensor can still identify the glucose concentration in the solution without being affected. This result proves that the sensor has considerable potential for developing into a high-performance non-enzymatic glucose sensor.

2021 ◽  
Vol 108 ◽  
pp. 103194
Author(s):  
Francisco R.A. Ziegler-Rivera ◽  
Blanca Prado ◽  
Alfonso Gastelum-strozzi ◽  
Jorge Márquez ◽  
Lucy Mora ◽  
...  

2019 ◽  
Vol 73 (11) ◽  
pp. 945-946
Author(s):  
Rachel Fischer ◽  
Marco Oetken

For aluminum, a new visualization method is presented in which copper is deposited electrochemically. The fingerprint on the aluminum (trace carrier) serves as an insulator as it prevents direct contact between electrolyte and aluminum. The decisive factor is the choice of an ammoniacal copper sulfate solution, which acts as a corrosion inhibitor due to the ammonia molecules. This enables uniform copper deposition on aluminum and thus the development of a clearly defined negative image.


2014 ◽  
Vol 84 (19) ◽  
pp. 2026-2035 ◽  
Author(s):  
Bing Li ◽  
Dapeng Li ◽  
Jiping Wang

A three-axis automatic robot was coupled with a precision liquid dispenser to deposit copper on fabrics to be used as the conductive layer for assembly of textile-based flexible microstrip patch antennas. Two reactive solutions, copper sulfate and sodium borohydride, were sequentially dispensed on fabrics and a conductive copper was produced in situ and in real time, through a simple redox mechanism. Driving pressure, the number of dispensing cycles, concentration and composition (i.e. the addition of a complexing agent sodium citrate to the copper sulfate solution) of the reactive solutions were studied to optimize the dispensing process in favor of rapid copper deposition. The electrical performance of the resulting copper deposit and its adhesion to the textile substrates were characterized. A copper coating of about 0.2 ohm/□ sheet resistance could be prepared in less than 1 hour under a 45 kPa driving pressure, at a 200 mm·s−1 moving speed, and within 60 dispensing cycles.


1983 ◽  
Vol 22 (8) ◽  
pp. 1184-1187 ◽  
Author(s):  
A. Musinu ◽  
G. Paschina ◽  
G. Piccaluga ◽  
M. Magini

1990 ◽  
Vol 204 ◽  
Author(s):  
R. J. Von Gutfeld ◽  
D. R. Vigliotti

ABSTRACTWe describe a two step method that uses thermally driven exchange plating to repair open copper circuits with local heating produced by ac Joule losses. The first step utilizes a non-acid copper sulfate solution to grow copper dendrites across the open circuit. This electrical “bridge” is then strengthened using additional plate-up in acid copper sulfate.


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