scholarly journals Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1918
Author(s):  
Dongpo Wang ◽  
Shouxiang Lu ◽  
Dong Xu ◽  
Yuanlin Zhang
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Failure Modes ◽  
High Efficiency ◽  
Abrasive Particle ◽  
Grinding Force ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Cutting Test ◽  
Sic Composites

C/SiC composites are the preferred materials for hot-end structures and other important components of aerospace vehicles. It is important to reveal the material removal mechanism of ultrasound vibration-assisted grinding for realizing low damage and high efficiency processing of C/SiC composites. In this paper, a single abrasive particle ultrasound vibration cutting test was carried out. The failure modes of SiC matrix and carbon fiber under ordinary cutting and ultrasound cutting conditions were observed and analyzed. With the help of ultrasonic energy, compared with ordinary cutting, under the conditions of ultrasonic vibration-assisted grinding, the grinding force is reduced to varying degrees, and the maximum reduction ratio reaches about 60%, which means that ultrasonic vibration is beneficial to reduce the grinding force. With the observation of cutting debris, it is found that the size of debris is not much affected by the a p with ultrasound vibration. Thus, the ultrasound vibration-assisted grinding method is an effective method to achieve low damage and high efficiency processing of C/SiC composites.

Study on Grinding Force of High Volume Fraction SiCp/Al Composites with Rotary Ultrasonic Vibration Grinding

2014 ◽  
Vol 1027 ◽  
pp. 48-51 ◽  
Author(s):  
Dao Hui Xiang ◽  
Yu Long Zhang ◽  
Guang Bin Yang ◽  
Song Liang ◽  
Yan Feng Wang ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Volume Fraction ◽  
High Volume ◽  
Grinding Force ◽  
High Volume Fraction ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Parameters ◽  
Ultrasonic Grinding

High volume fraction SiCp/Al composites were grinded in rotary ultrasonic vibration aided grinding in this experiment, exploring the effects of different grinding parameters (grinding depth, grinding wheel speed, feed rate) on grinding force and the material removal mechanism with ultrasonic grinding. The results showed that grinding force of ultrasonic grinding is lower than the ordinary grinding in the same grinding parameters. Studying on material removal mechanism of ultrasonic vibration grinding is bound to have important theoretical and practical significance for the improvement of grinding processes and the development of mechanical according to the advantages of grinding and ultrasonic machining. Keywords: High volume fraction SiCp/Al composites; ultrasonic grinding; grinding force

On Material Removal Mechanism in High Speed Single Grit Scratch-Grinding of Cryo-Treated Al2024-T351 Aluminium Alloy

2020 ◽  
Vol 1009 ◽  
pp. 123-128
Author(s):  
Sweety Satpathy ◽  
Amitava Ghosh
Keyword(s):  
Tensile Strength ◽  
Material Removal ◽  
High Speed ◽  
Scratch Test ◽  
Grinding Force ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Tool ◽  
Side Flow ◽  
Single Grit Scratch

Feasibility of utilizing cryogenic technology to improve the shearability of Al2024-T351 alloy is experimentally investigated by carrying out a single grit scratch-grinding test. A single grit brazed diamond grinding tool is developed for the study. Al2024-T351 work specimens are treated with liquid nitrogen for 6 hours before the scratch test. Although there was no significant change in the tensile strength of the material, the surface experiences change in the microhardness. It helps in arresting the side flow and ploughing of the material during high speed scratch grinding. The scratched grooves on cryo-treated samples, compare to those of untreated specimens, shows signs of cleaner shear-cuts, superior finish and produces less grinding force during grinding

Experimental Research on Surface Integrity of Ceramic Nanocomposites in Two-Dimensional Ultrasonic Vibration Grinding

2007 ◽  
Vol 329 ◽  
pp. 445-450 ◽  
Author(s):  
Bo Zhao ◽  
Yan Wu ◽  
Feng Jiao ◽  
G.F. Gao ◽  
Xun Sheng Zhu
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
Machining Accuracy ◽  
Two Dimensional ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Pull Out ◽  
Material Removal Model ◽  
Ceramic Nanocomposites

The grain cutting trace of elliptical spiral in workpiece two-dimensional ultrasonic vibration grinding(WTDUVG) is defined, the reason of machining accuracy improvement by applying two-dimensional ultrasonic vibration is discussed. Adopting two-dimensional ultrasonic composite processing, the influences of grinding depth, worktable velocity, wheel granularity on the surface roughness of Al2O3/ZrO2 ceramic nanocomposites were described. Experimental results of AFM microstructure show that the material removal model in WTDUVG is dominated by ductile flow of material, some crystal refinement, the crush powder and grain pull-out are visible and there is almost no fracture. Furthermore, the surface roughness in WTDUVG with coarse grit is about 30 40% less than that in CG under identical grinding condition; the qualitative analysis of X-diffraction results indicated that the surface phases are composed of α-Al2O3, t-ZrO2 and small quality m-ZrO2, there are amorphous phase in the surface both with and without vibration grinding. M-zirconia phase transitions rule in vibration and conventional grinding was found. Under definitive grinding conditions, the material removal mechanism of inelastic deformation is the principal removal mechanism of Al2O3/ZrO2 ceramic nanocomposites, the grit size of diamond wheel and vibration grinding mode have important influence on material removal mechanism of ceramic nanocomposites.

scholarly journals Modeling and Analysis of the Material Removal Rate for Ultrasonic Vibration-assisted Polishing of Optical Glass BK7

2021 ◽  
Author(s):  
Yingdong Liang ◽  
Chao Zhang ◽  
Xin Chen ◽  
Tianqi Zhang ◽  
Tianbiao Yu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Material Removal Model

Abstract The emergence of ultrasonic vibration-assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in modern optical industry, however, the material removal mechanism of ultrasonic vibration-assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration-assisted polishing of optical glass (BK7), the application of ultrasonic vibration to axial vibration and the atomization of polishing slurry, the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow-rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model can not only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass.

Sign in / Sign up

Export Citation Format

Share Document