scholarly journals In Situ Characterization of Inconel 718 Post-Dynamic Recrystallization within a Scanning Electron Microscope

Metals ◽  
2017 ◽  
Vol 7 (11) ◽  
pp. 476 ◽  
Author(s):  
Meriem Zouari ◽  
Roland Logé ◽  
Nathalie Bozzolo
2006 ◽  
Vol 983 ◽  
Author(s):  
Xuefeng Wang ◽  
Chang Liu

AbstractWe report recent development of a three-probe micromachined nanomanipulator for manipulation and in-situ characterization of nanomaterials in scanning electron microscope (SEM). The nanomanipulator consists of three independent probes having thermal bimetallic actuators and nanoscopic end-effectors. Nanoscale end-effectors with sub-100-nm spacing are created using focused ion beam (FIB) milling to directly interface with nanoscopic objects (e.g., nanotubes, nanowires). Handling of individual carbon nanotubes (CNTs) was successfully realized with the nanomanipulator in an SEM.


Nanoscale ◽  
2017 ◽  
Vol 9 (42) ◽  
pp. 16349-16356 ◽  
Author(s):  
Brett B. Lewis ◽  
Brittnee A. Mound ◽  
Bernadeta Srijanto ◽  
Jason D. Fowlkes ◽  
George M. Pharr ◽  
...  

Nanomechanical measurements of platinum–carbon 3D nanoscale architectures grown via focused electron beam induced deposition (FEBID) were performed using a nanoindentation system in a scanning electron microscope (SEM) for simultaneous in situ imaging.


Author(s):  
R. F. Schneidmiller ◽  
W. F. Thrower ◽  
C. Ang

Solid state materials in the form of thin films have found increasing structural and electronic applications. Among the multitude of thin film deposition techniques, the radio frequency induced plasma sputtering has gained considerable utilization in recent years through advances in equipment design and process improvement, as well as the discovery of the versatility of the process to control film properties. In our laboratory we have used the scanning electron microscope extensively in the direct and indirect characterization of sputtered films for correlation with their physical and electrical properties.Scanning electron microscopy is a powerful tool for the examination of surfaces of solids and for the failure analysis of structural components and microelectronic devices.


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