scholarly journals Thermally Conductive Film Fabricated Using Perforated Graphite Sheet and UV-Curable Pressure-Sensitive Adhesive

Nanomaterials ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 93
Author(s):  
Hee-Jin Lee ◽  
Gayoung Lim ◽  
Eunseong Yang ◽  
Young-Seok Kim ◽  
Min-Gi Kwak ◽  
...  
Keyword(s):  
Abietic Acid ◽  
Air Bubbles ◽  
Pressure Sensitive Adhesive ◽  
Graphite Sheet ◽  
Uv Curable ◽  
Free Film ◽  
Conductive Films ◽  
Pressure Sensitive ◽  
Conductive Film ◽  
Thermally Conductive

Thermally conductive films play a crucial role in expanding the lifetime of electronics by dissipating concentrated heat to heatsinks. In this work, a thermally conductive film (g-TC film) was manufactured using a perforated graphite sheet (p-GS) and a UV-curable pressure-sensitive adhesive (PSA) by lamination. A novel UV-curable PSA was prepared by incorporating a UV-curable abietic acid ester into a PSA composition. The UV-curable PSA became a tack-free film upon UV irradiation; thus, a flexible g-TC film with a 52-μm thickness was obtained. The defects in the g-TC film caused by air bubbles were removed by treating the p-GS with oxygen plasma. As the UV-cured PSA made a joint through the holes in the p-GS, cleavage of the graphite was not observed after 10,000 U-folding test cycles with a folding radius of 1 mm. The calculated in-plane thermal conductivity of the fabricated g-TC film was 179 W∙m−1K−1, which was stable after the U-folding tests.

scholarly journals Synthesis of benzocyclobutenone containing polymers for UV curable pressure sensitive adhesive applications

ARKIVOC ◽  
2005 ◽  
Vol 2005 (13) ◽  
pp. 29-36
Author(s):  
Kai Li ◽  
Prakash Mallya ◽  
Wayne Wang ◽  
Pradeep Iyer
Keyword(s):  
Pressure Sensitive Adhesive ◽  
Uv Curable ◽  
Pressure Sensitive

Preparation of High-Solids UV-Curable Actylate Pressure-Sensitive Adhesive with Low Viscosity for Printed Electronics

2014 ◽  
Vol 644-650 ◽  
pp. 4936-4940
Author(s):  
Yan Yan Cui ◽  
Guang Xue Chen
Keyword(s):  
Printed Electronics ◽  
High Solids ◽  
Pressure Sensitive Adhesive ◽  
Uv Curable ◽  
Ink Jet Printing ◽  
Pressure Sensitive Adhesives ◽  
Low Viscosity ◽  
Pressure Sensitive ◽  
Ink Jet ◽  
Jet Printing

If the pressure sensitive adhesive is coated on the back, it can be used for bonding electronic tag, overburden, protective layer, and RFID layer. The acrylate pressure sensitive adhesives are simple and less pollution, so more and more companies pay attention on this kind of binder. Since the thickness of adhesive layer is relatively small, ink-jet printing is now widely used to easily obtain thin layer and design the pressure sensitive adhesive shape of different parts. So how to get superior performance pressure sensitive adhesive which is suitable for ink-jet printing become an urgent problem in printed electronics. The experiment was conducted through solution copolymerization of various vinyl monomers which were selected on the principle of solvent parameter prepared by free radical polymerization. The monomer, initiator mixture solution was dropped in continuous and synchronization process. By regulating the amount of initiator and polymerization temperature, we could effectively reduce the system viscosity and prepare high quality high-solids acrylate UV-curable pressure sensitive adhesives with low viscosity for ink-jet printing. The influence of initiator, solvents, transfer reagents and temperature on the structure and properties of the resin were discussed.

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

2017 ◽  
Author(s):  
Naoya Saiki ◽  
Yuichiro Komasu ◽  
Kazuto Aizawa ◽  
Jun Maeda
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Speed ◽  
Adhesive Layer ◽  
Adhesive Tape ◽  
Pressure Sensitive Adhesive ◽  
Element Analysis ◽  
Uv Curable ◽  
Pressure Sensitive ◽  
Peeling Process

In this study, the peeling process of UV-curable pressure sensitive adhesive tape from bump wafer is investigated through the use of finite element analysis, observation of high speed video, and actual wafer back-grinding process testing. In our experiment, a large deformation of adhesive is observed at the edge of bottom of bump, appearing on the side of the bump opposite tape-peeling direction when observed with high speed microscope video. The largely deformed adhesive creates a string shaped elongation. The adhesive residue is caused by the fracture of the adhesive string. We investigated how to generate the adhesive string in the tape-peeling process through the use of finite element analysis. In this analysis, a cohesive element is introduced into the adhesive layer. The analytical result shows the adhesive string at the same position of experiment and the stress distribution is different between the string part and the other area of adhesive. The influence of peeling angle and bump size is also investigated by the same finite element model. As a result, higher peeling angle and smaller bump sizes shows a shorter adhesive string, which lowers the risk of adhesive residue.

Effect of castor oil based urethane oligomer on properties of UV-curable pressure sensitive adhesive for peelable wafer dicing tape

2020 ◽  
Vol 34 (23) ◽  
pp. 2499-2509
Author(s):  
Panpan Hao ◽  
Bingyan Sun ◽  
Xiaomeng Chu ◽  
Yujuan Sun ◽  
Xuteng Xing ◽  
...  
Keyword(s):  
Castor Oil ◽  
Pressure Sensitive Adhesive ◽  
Uv Curable ◽  
Pressure Sensitive

Synthesis of polyurethane acrylate and application to UV-curable pressure-sensitive adhesive

2005 ◽  
Vol 8 (4) ◽  
pp. 383-396 ◽  
Author(s):  
Yaobin Ren ◽  
Huiming Pan ◽  
Longsi Li ◽  
Jianming Xia ◽  
Yongqiang Yang
Keyword(s):  
Pressure Sensitive Adhesive ◽  
Uv Curable ◽  
Polyurethane Acrylate ◽  
Pressure Sensitive

UV-curable pressure sensitive adhesive films: effects of biocompatible plasticizers on mechanical and adhesion properties

Soft Matter ◽  
2013 ◽  
Vol 9 (27) ◽  
pp. 6270 ◽  
Author(s):  
Sara Faraji Dana ◽  
Duc-Viet Nguyen ◽  
Jaspreet Singh Kochhar ◽  
Xiang-Yang Liu ◽  
Lifeng Kang
Keyword(s):  
Pressure Sensitive Adhesive ◽  
Uv Curable ◽  
Adhesion Properties ◽  
Pressure Sensitive

Study of acrylic emulsion for ultraviolet curable pressure sensitive adhesives and its properties

2011 ◽  
Vol 40 (6) ◽  
pp. 374-378 ◽  
Author(s):  
Nishant Bhore ◽  
Prakash Mahanwar
Keyword(s):  
Uv Curing ◽  
Cohesive Strength ◽  
Pressure Sensitive Adhesive ◽  
Acrylic Emulsion ◽  
Uv Curable ◽  
Performance Properties ◽  
Content Type ◽  
Pressure Sensitive ◽  
Water Based ◽  
Peel Adhesion

PurposeThe purpose of this paper is to synthesise UV curable emulsion latex and to study characteristics and various performance properties such as tackiness, peel adhesion and cohesive strength for pressure sensitive adhesive (PSA) application after UV curing.Design/methodology/approachThe two component water‐based ultraviolet (UV) curable acrylate PSAs were synthesised by emulsion copolymerization. The synthesised emulsion samples were characterised and various performance properties such as tackiness, peel adhesion and cohesive strength for PSAs were tested after UV curing.FindingsThe thermal analysis showed the effect of methyl methacrylate (MMA) content on the glass transition temperature of emulsions, which had significant effect on tack. Effects of varying concentration of multifunctional monomer trimethylolpropane triacrylate (TMPTA) and UV exposure time on properties of UV curable PSA were also studied.Research limitations/implicationsThe results associated with the UV curable water based PSA has certain advantages, such as low VOC and fast curing rate and with the scope for further research by using the radiations with different intensities or other radiation systems such as electron beam curing.Practical implicationsPractically the UV water based PSAs are already in industrial use for glass lamination, silicon semiconductor dicing, and in medical use for band aids and drug delivery systems and for dental applications for cavity filling.Originality/valueThe water based UV curable PSA synthesised by emulsion polymerization had very good tackiness properties with lower MMA content. It was observed that the lower the concentration of TMPTA, the better the performance properties, such as tack and peel strength. It was also observed that with increasing TMPTA concentration the cohesive strength increased.

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