Impact of channel mobility on design optimization of 600-3300V-class high-speed GaN vertical-trench MOSFETs based on TCAD simulation

Author(s):  
Takashi Ishida ◽  
Keisuke SAKAO ◽  
Tetsu KACHI ◽  
Jun SUDA
Author(s):  
D. Polak ◽  
M. Hovanec ◽  
P. Korba ◽  
K. Semrad ◽  
S. A. S. Al-Rabeei ◽  
...  

Author(s):  
Gabriel Madrigal-Boza ◽  
Marco Oviedo-Hernandez ◽  
Allan Carmona-Cruz ◽  
Luis A. Chavarria-Zamora ◽  
Daniel Leon-Gamboa ◽  
...  

2004 ◽  
Vol 13 (01) ◽  
pp. 121-136 ◽  
Author(s):  
T. AHMAD ◽  
M. A. HOSSAIN ◽  
A. K. RAY ◽  
Z. GHASSEMLOOY

This paper presents an investigation of the design optimization in microstrip lines to reduce the crosstalk level using Fuzzy Logic. In microstrip lines length and spacing, termination conditions of interconnection and output impedance of gates are the major components that cause crosstalk. In order to design high speed printed circuit board (PCB) with optimum interconnection configuration, it is essential to reduce the crosstalk to its minimum tolerance level. A design methodology is proposed to correlate electrical parameters and physical configuration of lines to the crosstalk phenomena. This design is subsequently optimized using Fuzzy Logic to reduce the level of crosstalk. A set of experiments is carried out to demonstrate the capabilities of the design and optimization methods. The effect of the geometrical configuration of the lines on crosstalk, particularly the spacing, is highlighted.


2006 ◽  
Author(s):  
B. M. A. Rahman ◽  
Shyqyri Haxha ◽  
Vesel Haxha ◽  
Kenneth T. V. Grattan

2006 ◽  
Author(s):  
B. M. Azizur Rahman ◽  
Shyqyri Haxha ◽  
Vesel Haxha ◽  
Kenneth T. V. Grattan

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