scholarly journals https://www.ijrte.org/download/volume-8-issue-2/

2019 ◽  
Vol 8 (2) ◽  
pp. 4997-5001

In this paper, the performance of U-slot Rectangular Microstrip Patch Antennas (RMSA) is analyzed by using different flexible substrates. The RMSA is designed to operate for a resonant frequency of 2.45 GHz with flexible substrate materials like Polydimethylsiloxane (PDMS), GML-1032 and Polyethylene. The antenna parameters like reflection coefficient, voltage standing wave ratio (VSWR), radiation pattern, bandwidth and cost are analyzed by keeping all the substrate height same and the value is 2.5mm. U-slot cutting is used in the patch to overcome the narrow bandwidth limitation in RMSA because U-slot tunes the higher order orthogonal mode resonance frequency of the patch with respect to fundamental mode to realize the wider bandwidth. The maximum bandwidth of 80MHz is achieved with the use of PDMS. The antenna is simulated using HFSS software.

Electronics ◽  
2022 ◽  
Vol 11 (1) ◽  
pp. 129
Author(s):  
Oscar Ossa-Molina ◽  
Francisco López-Giraldo

In this study, we developed an analytical model of slot-loaded rectangular microstrip patch antennas based on the simulation results by varying slot parameters. The dominant resonant frequency predicted by such a model is in strong agreement with the experimental results measured at several locations of slot-loaded rectangular microstrip patch antennas. The model enables a reliable and quick computation of the resonant frequency, which generally follows a harmonic behavior that nearly resembles the resonant frequency of a microstrip antenna without a slot, which can be related to a small change in the impedance caused by the slot position. Results showed a good agreement between simulations and measurements for all the slot positions. Mathematical analytic functions to describe the changes in specific characteristic parameters of the slot-loaded rectangular microstrip patch antennas are also included.


Polymers ◽  
2020 ◽  
Vol 12 (10) ◽  
pp. 2400
Author(s):  
Ahmad Fahad Ahmad ◽  
Sidek Ab Aziz ◽  
Yazid Yaakob ◽  
Ammar Abd Ali ◽  
Nour Attallah Issa

The study intended to utilizing waste organic fiber for low-cost semi-flexible substrate fabrication to develop microstrip patch antennas for low band communication applications. All the semi-flexible substrates (12.2 wt. % OPEFF/87.8 wt. % PCL, 12.2 wt. % NiO/87.8 wt. % PCL, and 25 wt. % OPEFF/25 wt. % NiO/50 wt. % PCL) were fabricated by oil palm empty fruit fiber (OPEFF) mixed with nickel oxide (NiO) nanoparticles reinforced with polycaprolactone (PCL) as a matrix using a Thermo Haake blending machine. The morphology and crystalized structure of the substrates were tested using Fourier transform infrared (FTIR) spectrometry, X-ray diffraction (X-RD) technique, and scanning electron microscopy (SEM), respectively. The thermal stability behavior of the substrates was analyzed using thermogravimetric analysis (TGA) and differential thermogravimetric (DTG) thermogram. The dielectric properties were characterized by an open-ended coaxial probe (OEC) connected with Agilent N5230A PNA-L Network Analyzer included the 85070E2 dielectric software at frequency range of 8 to 12 GHz. The experimental results showed that NiO/OPEFF/PCL composites exhibit controllable permittivity dielectric constant εr′(f) between 1.89 and 4.2 (Farad/meter, (F/m)), with loss factor εr′′(f) between 0.08 and 0.62 F/m, and loss tangent (tan δ) between 0.05 and 0.18. Return losses measurement of the three patch antennas OPEFF/PCL, NiO/PCL, and OPEFF/NiO/PCL are −11.93, −14.2 and −16.3 dB respectively. Finally, the commercial software package, Computer Simulation Technology Microwave Studio (CSTMWS), was used to investigate the antenna performance by simulate S-parameters based on the measured dielectric parameters. A negligible difference is found between the measured and simulated results. Finally, the results obtained encourage the possibility of using natural fibers and nickel oxide in preparation of the substrates utilize at microwave applications.


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