scholarly journals Nd2Fe14B: (Nd1-x Dyx)2 Fe14B CORE-SHELL STRUCTURE FORMATION BY HOT PRESS LIQUID PHASE SINTERING

2016 ◽  
Author(s):  
Li Chen
2016 ◽  
Vol 122 (4) ◽  
Author(s):  
Mingyang Li ◽  
Peng Jia ◽  
Xiaofei Sun ◽  
Haoran Geng ◽  
Min Zuo ◽  
...  

2018 ◽  
Vol 216 ◽  
pp. 70-72 ◽  
Author(s):  
Yinli Peng ◽  
Liang Zhang ◽  
Lei Wang ◽  
Xiaowei Lei ◽  
Wenjing Yao ◽  
...  

2014 ◽  
Vol 670-671 ◽  
pp. 22-25 ◽  
Author(s):  
Sui Yuan Chen ◽  
Jin Huan Wang ◽  
Xian Zhou ◽  
Jing Liang ◽  
Chang Sheng Liu

The targets are micron-sized TiO2 powders and micron-sized Ag powders, TiO2@Ag nanocomposite particles with core-shell structure were synthesized by pulsed laser gas phase evaporation-liquid phase collecting method. The morphology, structure and synthesis mechanism of the samples were studied by means of transmission electron microscopy (TEM), energy dispersive spectrometer (EDS), and X-ray diffraction technique (XRD). The results show that the pure TiO2 nanoparticles sol was firstly prepared as liquid phase collecting system using gas phase evaporation-liquid phase collecting method; then, the target was changed using Ag, and TiO2 @ Ag nanocomposite particles with core-shell structure, which are spherical or ellipsoidal, were successfully synthesized under certain conditions of laser synthesis parameters; the diameters of most TiO2@Ag nanocomposite particles covering synthesized after 2h range from 15nm to 35nm, the diameters of most TiO2 @Ag nanocomposite particles covering synthesized after 4h range from 25nm to 50nm, and the size of nanocomposite particles increases with the increase of covering synthesis time; TiO2 nanoparticles synthesized previously in liquid phase function as crystallized cores, while Ag atoms and their clusters are adsorbed to TiO2 surfaces and surround the surfaces to form TiO2 @ Ag nanocomposite particles.


2017 ◽  
Vol 62 (2) ◽  
pp. 1143-1148 ◽  
Author(s):  
Jun Ho Hwang ◽  
Jong-Hyun Lee

AbstractSn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.


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