Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding
2017 ◽
Vol 32
(1)
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pp. 441-451
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2017 ◽
Vol 62
(2)
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pp. 1143-1148
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Keyword(s):
Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content
2020 ◽
Vol 10
(10)
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pp. 1604-1610
2013 ◽
Vol 28
(5)
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pp. 2448-2456
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2015 ◽
Vol 619
◽
pp. 332-337
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Keyword(s):
2014 ◽
Vol 670-671
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pp. 22-25
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2017 ◽
Vol 37
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pp. 561-570
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Keyword(s):