EUTECTIC MICROSTRUCTURE EVOLUTION OFDIRECTIONALLY SOLIDIFIED Nb-Ti-Si BASEULTRAHIGH TEMPERATURE ALLOY

2013 ◽  
Vol 49 (7) ◽  
pp. 853 ◽  
Author(s):  
Xiaofei LI ◽  
Xiping GUO
2014 ◽  
Vol 875-877 ◽  
pp. 1525-1528 ◽  
Author(s):  
Er Min Wang ◽  
Qi Hu Hong ◽  
Zhi Ming Ni ◽  
Jin Han

Self-made tension machine was used to measure the evolution of recovery stress under different processing state for NiTiNb alloy. Then, SEM was used to investigate the microstructure evolution. The results show that the range of the highest recovery stress for forged NiTiNb alloy is between 210-215MPa. Otherwise, the recovery stress level of the samples enduring cold drawing and hot rolling is basically same, which all belong to the rage of 210-220MPa. After forging, the firstly precipitated TiNi phase particles become fine, only 5-8μm. The Nb tablets in eutectic microstructure, which originally contributed between TiNi phase particles, appear spheroidization.


2016 ◽  
Vol 117 ◽  
pp. 205-214 ◽  
Author(s):  
Philipp Steinmetz ◽  
Johannes Hötzer ◽  
Michael Kellner ◽  
Anne Dennstedt ◽  
Britta Nestler

2014 ◽  
Vol 29 (9) ◽  
pp. 941
Author(s):  
JIANG Jin-Long ◽  
WANG Qiong ◽  
HUANG Hao ◽  
ZHANG Xia ◽  
WANG Yu-Bao ◽  
...  

Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.


2020 ◽  
Author(s):  
Yuanjiang Lv ◽  
Xin Xin Lian ◽  
Haoliang Sun ◽  
Xiaoxue Huang ◽  
Guang xin Wang

2021 ◽  
Vol 544 ◽  
pp. 152686
Author(s):  
Yutaka Sugimoto ◽  
Masaru Nakamichi ◽  
Jae-Hwan Kim ◽  
Hiroki Kurata ◽  
Mitsutaka Haruta ◽  
...  

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