High-aspect-ratio gas chromatography column based on micro-electro-mechanical system technology

2018 ◽  
Vol 36 (9) ◽  
pp. 911
Author(s):  
Fan LUO ◽  
Fei FENG ◽  
Bin ZHAO ◽  
Bowen TIAN ◽  
Xuelei YANG ◽  
...  
Keyword(s):  
Gas Chromatography ◽  
Aspect Ratio ◽  
Mechanical System ◽  
High Aspect Ratio ◽  
Micro Electro Mechanical System ◽  
System Technology ◽  
Chromatography Column

MEMS-Based Gas Chromatography Column for the Analysis of Chemical Warfare Agent (CWA) Simulates

2013 ◽  
Vol 475-476 ◽  
pp. 1294-1298
Author(s):  
Yi Li ◽  
Xiao Song Du ◽  
Yang Wang ◽  
Hui Ling Tai ◽  
Dong Qiu ◽  
...  
Keyword(s):  
Gas Chromatography ◽  
Chemical Warfare Agent ◽  
Micro Electro Mechanical System ◽  
Chemical Warfare ◽  
Triethyl Phosphate ◽  
Deep Reactive Ion Etching ◽  
Chromatography Column ◽  
Three Samples ◽  
Mems Technology ◽  
Efficient Column

In this report the gas chromatography column was fabricated base on micro electro mechanical system (MEMS) technology. It tries to find an equilibrium point which can fast detect CWA stimulants with efficient column separation. Under deep reactive-ion etching (DRIE) process, a 1m length, 90 um thickness and 300 um height which form 3:1high-aspect-ratio, MEMS-based silicon GC column was fabricated. The GC column was coated with 95%Methyl 5% Phenyl Polysilozane (DB-5) as the stationary phase. Dimethyl methyl phosphonate (DMMP), Triethyl phosphate (TEP) and Methy salicylate were used for CWA simulations. All of these three samples can be separated less than 90s with reasonable column efficiency.

Fabrication of Sub-Micron Silicon Vias by Deep Reactive Ion Etching

2005 ◽  
Author(s):  
Shawn X. D. Zhang ◽  
Ronald Hon ◽  
S. W. Ricky Lee
Keyword(s):  
Aspect Ratio ◽  
Mechanical System ◽  
Reactive Ion Etching ◽  
Micro Electro Mechanical System ◽  
Experimental Results ◽  
Mems Devices ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
3D Packaging ◽  
Silicon Vias

Deep reactive ion etching (DRIE) is a major microfabrication process for micro-electro-mechanical system (MEMS) devices. In recent years DRIE is also applied to make through-silicon-vias (TSVs) for 3D packaging. Typical DRIE-formed TSVs are in the range of a few microns to tens of microns. In the present study, silicon vias with diameters in the sub-micron range (0.5 μm and 0.8 μm) are attempted. For comparison purposes, larger silicon vias (1 μm and 3 μm) are fabricated as well. In this paper, the microfabrication processes are described. The experimental results and comparisons in terms of via uniformity, aspect ratio dependent etching, undercutting, and effects of various mask materials are discussed in detail.

A MEMS Fluid Density Sensor Based on Trapezoidal Cantilever

2011 ◽  
Vol 483 ◽  
pp. 374-377
Author(s):  
Li Bo Zhao ◽  
En Ze Huang ◽  
Gui Ming Zhang ◽  
Yu Long Zhao ◽  
Xiao Po Wang ◽  
...  
Keyword(s):  
Mechanical System ◽  
Micro Electro Mechanical System ◽  
Fluid Density ◽  
System Technology ◽  
Ansys Software ◽  
Cantilever Structure ◽  
Simulation Results ◽  
Optimum Solution

A kind of fluid density sensor based on MEMS (Micro-Electro-Mechanical-System) technology is introduced with trapezoidal cantilever structure. The rectangular cantilever and trapezoidal cantilever, based on the same parameters, are analyzed. The simulation results show that the sensitivity of trapezoidal cantilever is higher than that of rectangular cantilever. Four different sizes of trapezoidal cantilever are analyzed by modal and harmonic simulation with ANSYS Software, the optimum solution will be obtained from simulation results.

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