Synthesis and Photoluminescence of Silicon Nanoparticles Fabricated by Pulse Laser Ablation

2010 ◽  
Vol 37 (3) ◽  
pp. 882-886
Author(s):  
朱世伟 Zhu Shiwei ◽  
王磊 Wang Lei ◽  
陈兴 Chen Xing ◽  
屠海令 Tu Hailing ◽  
杜军 Du Jun
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2009 ◽  
Vol 255 (17) ◽  
pp. 7605-7609 ◽  
Author(s):  
D.P. Korfiatis ◽  
K.-A. Th. Thoma ◽  
J.C. Vardaxoglou

2013 ◽  
Vol 8 (02) ◽  
pp. P02007-P02007 ◽  
Author(s):  
V Chaudhari ◽  
K Patel ◽  
A Srivastava ◽  
V Sivakumaran ◽  
R K Singh ◽  
...  

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